DP83867IR, DP83867CR
ZHCSDE3G –FEBRUARY 2015 –REVISED OCTOBER 2022
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Table of Contents
7.17 Timing Diagrams ....................................................25
7.18 Typical Characteristics............................................30
8 Detailed Description......................................................31
8.1 Overview...................................................................31
8.2 Functional Block Diagram.........................................32
8.3 Feature Description...................................................34
8.4 Device Functional Modes..........................................37
8.5 Programming............................................................ 51
8.6 Register Maps...........................................................59
9 Application and Implementation................................ 118
9.1 Application Information............................................118
9.2 Typical Application.................................................. 118
10 Power Supply Recommendations............................125
11 Layout.........................................................................128
11.1 Layout Guidelines................................................. 128
11.2 Layout Example.................................................... 130
12 Device and Documentation Support........................131
12.1 Documentation Support........................................ 131
12.2 Related Links........................................................ 131
12.3 接收文档更新通知................................................. 131
12.4 支持资源................................................................131
12.5 Electrostatic Discharge Caution............................131
12.6 术语表................................................................... 131
12.7 Trademarks...........................................................131
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 1
4 Revision History.............................................................. 2
5 Device Comparison.........................................................8
6 Pin Configuration and Functions...................................8
6.1 Unused Pins .............................................................14
7 Specifications................................................................ 15
7.1 Absolute Maximum Ratings...................................... 15
7.2 ESD Ratings............................................................. 15
7.3 Recommended Operating Conditions.......................15
7.4 Thermal Information..................................................16
7.5 Electrical Characteristics...........................................16
7.6 Power-Up Timing...................................................... 18
7.7 Reset Timing.............................................................19
7.8 MII Serial Management Timing................................. 19
7.9 RGMII Timing............................................................19
7.10 GMII Transmit Timing(2) ......................................... 20
7.11 GMII Receive Timing(2) .......................................... 20
7.12 100-Mbps MII Transmit Timing(1) ........................... 20
7.13 100-Mbps MII Receive Timing(2) ............................20
7.14 10-Mbps MII Transmit Timing(2) ............................. 21
7.15 10-Mbps MII Receive Timing(2) ..............................21
7.16 DP83867IR/CR Start of Frame Detection Timing... 21
4 Revision History
注：以前版本的页码可能与当前版本的页码不同
Changes from Revision F (October 2019) to Revision G (August 2022)
Page
• 更新了IEEE 1588 时间戳的帧起始检测............................................................................................................. 1
• Added following wording to the end of first paragraph in 节8.4.3.9 "DP83867 devices manufactured after
August, 2022, have an increased random seed value that now includes 255 different seed values to expedite
Auto-MDIX resolution with a link partner."........................................................................................................ 46
• Removed Reg 0x01D5 Programmable Gain Register (PROG_GAIN).............................................................59
• Changed Bit 11:10 SPEED_OPT_ATTEMPT_CNT to RW description in ........................................................79
• Changed bits 15:9, so that bit 12 can be '1'. Bit 7 description updated 节8.6.31 ............................................90
• Added Register 0x008A....................................................................................................................................96
• Added Register 0x00B3....................................................................................................................................97
• Added Register 0x00C0....................................................................................................................................97
• Added Register 0x0100.................................................................................................................................... 98
Changes from Revision E (March 2017) to Revision F (October 2019)
Page
• 向节1 添加了“符合时间敏感网络(TSN) 标准”..............................................................................................1
• 将节1 中的“快速链路建立/链路断开模式”更改为“快速链路断开模式”...................................................... 1
• 向节2 添加了“现场总线支持”......................................................................................................................... 1
• Changed 'TX_EN / TX_CTRL' pin type in Pin Functions..................................................................................10
• Deleted "NOTE: Internal Pull-Up/Pull-Down resistors on the IO pins are disabled when the device enters
functional mode after power up." from Pin Functions....................................................................................... 10
• Added XI pin voltage ratings to 节7.1 ............................................................................................................. 15
• Added XI Input Voltage section to 节7.5 .........................................................................................................16
• Changed links to RGMII timing diagrams in 节7.9 ..........................................................................................19
• Changed TholdR parameter description in 节7.9 ..............................................................................................19
Copyright © 2022 Texas Instruments Incorporated
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