FEATURES
• OUTPUT CURRENT UP TO 30A
• SMALL SIZE AND LOW PROFILE :
1.30” X 0.53” X 0.35”(SMD) ; 2.00” X 0.50” X 0.35” (SIP)
• HIGH EFFICIENCY UP TO 93%@5VIN, 3.3Vo, FULL LOAD
• DOS(H)30-05T : 4.5VDC TO 5.5VDC INPUT; 0.8VDC TO 3.63VDC OUTPUT
DOS30-12T : 6.0VDC TO 14.0VDC INPUT; 0.8VDC TO 3.63VDC OUTPUT
DOH30-12T : 6.0VDC TO 14.0VDC INPUT; 0.8VDC TO 5.5VDC OUTPUT
OUTPUT VOLTAGE PROGRAMMABLE VIA EXTERNAL RESISTOR
• FIXED SWITCHING FREQUENCY (300KHZ)
• MONOTONIC START-UP INTO PRE-BIASED OUTPUT
• OUTPUT VOLTAGE SEQUENCING
• PARALLEL OPERATION WITH ACTIVE CURRENT SHARING
• DESIGN MEETS UL60950-1, EN60950-1 AND IEC60950-1
• ISO9001 CERTIFIED MANUFACTURING FACILITIES
• COMPLIANT TO RoHS EU DIRECTIVE 2002/95/EC
APPLICATIONS
Wireless Network
Telecom/Datacom
Industry Control System
Distributed Power Architectures
Semiconductor Equipment
Microprocessor Power Applications
OPTIONS
Positive Logic Remote on/off, Current Share, Extra GND Pin, Long Pins
DESCRIPTION
DOS30 (SMD type), DOH30 (SIP type) are non-isolated DC/DC converters that can
deliver up to 30A of output current with full load efficiency of 93% at 5.0V input and
3.3V output.
T E C H N I C A L S P E C I F I C AT I O N All specifications are typical at nominal input, 3.3Vo, full load and 25ºC otherwise noted
INPUT SPECIFICATIONS
OUTPUT SPECIFICATIONS
DOS30-05T
DOH30-05T
DOS30-12T 0.8≦Vo≦2.75V
2.75<Vo≦3.63V
DOH30-12T 0.8≦Vo≦2.75V
2.75<Vo≦5.5V
30A max.
30A max.
30A max.
20A max.
30A max.
25A max.
DOS30-05T
DOH30-05T
Vin(nom) =5V
4.5 – 5.5VDC
Vin,min=Vo(set)+1.5V
Vin(nom) =12V 6.0 – 14.0VDC
Vin,min=Vo(set)+2.4V
Vin(min) to Vin(max); Io=Io(max) 27A
Input voltage range
Output current
DOS30-12T
DOH30-12T
Maximum input current
Input filter (Note 5)
Voltage accuracy
Minimum load
Full load and Vin(nom)
± 1.5%Vo(set)
0%
C filter
Start-up voltage
Shutdown voltage
Input under-voltage
lockout
4.4V,typ.
4.3V,typ.
Vin=Vin(min) to Vin(max)
Line regulation
± 0.1%Vo(set),typ.
at Full Load
Input reflected ripple
current (Note 6)
Load regulation
Ripple and noise (Note 2) 20MHz bandwidth
Temperature coefficient
No Load to Full Load
± 0.4%Vo(set),typ.
75mVp-p
5~20MHz, 1uH source impedance
100mAp-p
±0.5%, typ.
ENVIRONMENTAL SPECIFICATIONS
ΔIo /Δt = 5A/uS ,Vin(nom)
Peak deviation
Setting time
(Vo<10%peak
350mV,typ.
25μS,typ.
250mV,typ.
40μS,typ.
Dynamic load
Operating ambient temperature
Storage temperature range
Thermal shock
–40ºC ~ +85ºC(with derating)
–55ºC ~ +125ºC
Load change step
response
(50% to 100% or
(Note 2)
100% to 50% of Io(max)) deviation)
MIL-STD-810F
ΔIo /Δt = 5A/uS ,Vin(nom)
Load change step
(50% to 100% or
Peak deviation
Setting time
(Vo<10%peak
Dynamic load
response
(Note 3)
Over temperature protection
125ºC,typ.
FEATURE SPECIFICATIONS
100% to 50% of Io(max)) deviation)
Output current limit
Output short-circuit current
150%, typ.
Hiccup, Automatics recovery
2000uF,max.
Sequencing delay time (Note 7)
10msec,min.
Tracking accuracy
Power-up (2V/ms)
Power-down (1V/ms)
Active load share (option)
(Note 8)
∣VSEQ－Vo∣
ESR≧1mΩ
External load capacitance
Vin(min) to Vin(max); Io(min) to 100mV, typ.
ESR≧10mΩ
Vin=Vin(min) to
Vin(max); F.L.
DOS30-05T
10000uF,max.
Io(max); VSEQ < Vo.
Accuracy
Number of units in parallel
200mV, typ.
10% Io
Output voltage overshoot-startup
3%Vo(set), max.
5,max.
0.8VDC ~ 3.63VDC
0.8VDC ~ 3.63VDC
0.8VDC ~ 3.63VDC
0.8VDC ~ 5.5VDC
Remote ON/OFF (Note 9)
Negative logic(standard)
Voltage adjustability (see fig.1) DOH30-05T
(Note 4)
ON = -0.3V < Vr < 1.2V
IIN=200μA,max.
DOS30-12T
DOH30-12T
OFF = 3.0V < Vr < Vin(max) IIN=3.3mA,max.
ON = 3.0V < Vr < Vin(max) IIN=200μA,max.
Positive logic(option)
GENERAL SPECIFICATIONS
OFF= -0.3V < Vr < 1.2V
IIN=3.3mA,max.
Remote sense range
0.5V, max.
Efficiency
Isolation voltage
Switching frequency
Design meet safety standard
See table
None
300KHz, typ.
Rise time
Time for Vo to rise from 10% to 90%of Vo(set)
Case 1 (Note 10)
10ms, max.
2.5ms, typ.
2.5ms, typ.
IEC60950-1, UL60950-1, EN60950-1 Turn-on delay time
Case 2 (Note 11)
1.30 X 0.53 X 0.35 Inch
(33.0 X 13.5 X 8.8 mm)
2.00 X 0.50 X 0.35 Inch
(50.8 X 12.7 X 8.8 mm)
6.0g(0.21oz)
SMD
Dimensions
SIP
SMD
Weight
SIP
7.0g(0.25oz)
BELLCORE TR-NWT-000332
MIL-HDBK-217F
3.145 x 106 hrs
3.626 x 105 hrs
MTBF (Note 1)
Page 1 of 3 Issued Date：2007/10/15
5秒后页面跳转
英伟达新AI芯片Rubin或提前半年亮相
苹果iPhone 17将全系采用三星/LG显示LTPO OLED面板
三星深化印度制造布局，供应链本地化进程加速
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
微信公众号
抖音公众号
浙公网安备 33010502006866号 浙ICP备10014259号-119
营业执照ICP证
数据手册
如果您发现信息不准确，
