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DNAQ20TTEB PDF预览

DNAQ20TTEB

更新时间: 2024-11-18 06:54:15
品牌 Logo 应用领域
大兴电工 - KOA 总线通信驱动程序和接口二极管接口集成电路光电二极管
页数 文件大小 规格书
2页 97K
描述
diode terminator network

DNAQ20TTEB 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:QSOP
包装说明:QSOP-20针数:20
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.6
Is Samacsys:N差分输出:NO
接口集成电路类型:DIODE BUS TERMINATION ARRAYJESD-30 代码:R-PDSO-G20
JESD-609代码:e3长度:8.66 mm
湿度敏感等级:1功能数量:1
端子数量:20最高工作温度:155 °C
最低工作温度:-55 °C封装主体材料:PLASTIC/EPOXY
封装代码:SSOP封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, SHRINK PITCH峰值回流温度(摄氏度):260
认证状态:Not Qualified座面最大高度:1.8 mm
表面贴装:YES温度等级:MILITARY
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子节距:0.635 mm端子位置:DUAL
处于峰值回流温度下的最长时间:3宽度:5.99 mm
Base Number Matches:1

DNAQ20TTEB 数据手册

 浏览型号DNAQ20TTEB的Datasheet PDF文件第2页 
DN(X)  
diode terminator network  
EU  
features  
Fast reverse recovery time  
Low capacitance  
Fast turn on time  
SMD packages  
16 kV IEC61000-4-2 capable  
Products with lead-free terminations meet EU RoHS  
and China RoHS requirements  
applications  
Signal termination  
Signal conditioning  
ESD suppression  
Transient suppression  
dimensions and construction  
Dimensions inches (mm)  
S03  
S04  
Package Total  
L
L
Pins  
3
Pkg Ht  
Code Power  
L
0.2  
W
0.2  
p
0.ꢀ  
d 0.05  
P
0.2  
p
Bonding  
Bonding  
Wire  
Wire  
.115  
(2.92)  
.091  
(2.30)  
.075  
(1.91)  
.037  
(0.95)  
.017  
(0.43)  
S03 225mw  
Lead  
Die  
Pad  
.115  
(2.92)  
.091  
(2.30)  
.075  
(1.91)  
.037  
(0.95)  
.017  
(0.43)  
S04 225mw  
S06 225mw  
N08 400mw  
Q20 ꢀ000mw  
Q24 ꢀ000mw  
4
d
W
Lead  
W
Si  
Die  
Wafer  
.037  
(0.95)  
.037  
(0.95)  
.017  
(0.43)  
Pad  
.115  
(2.92)  
.110  
(2.80)  
d
Si  
6
Wafer  
Molded  
Resin  
Molded  
Resin  
.190  
(4.83)  
.236  
(5.99)  
.050  
(1.27)  
.063  
(1.60)  
.016  
(0.41)  
8
N08, Q20,  
Q24  
S06  
.341  
(8.66)  
.236  
(5.99)  
.025  
(0.635)  
.063  
(1.60)  
.010  
(0.25)  
L
p
L
20  
24  
Bonding  
Wire  
Bonding  
Wire  
.341  
(8.66)  
.236  
(5.99)  
.025  
(0.635)  
.063  
(1.60)  
.010  
(0.25)  
d
p
Lead  
Lead  
W
W
Die  
Pad  
Wafer  
Die  
d
Si  
Pad  
Si  
Molded  
Resin  
Wafer  
Molded  
Resin  
circuit schematic  
1
1
1
1
DN3: 6 pins  
DN4: 4 pins  
DN2: 20 pins  
DNA: 20 pins  
1
1
1
DN6: 8 pins  
DN5: 24 pins  
DN7: 24 pins  
For further information on packaging, please refer to Appendix A.  
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.  
11/21/08  
200  
KOA Speer Electronics, Inc. • 199 Bolivar Drive • Bradford, PA 16701 • USA • 814-362-5536 • Fax: 814-362-8883 • www.koaspeer.com  

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