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DNAS14TTEB PDF预览

DNAS14TTEB

更新时间: 2024-11-18 20:59:31
品牌 Logo 应用领域
大兴电工 - KOA 接口集成电路
页数 文件大小 规格书
2页 111K
描述
Diode Termination Array, ROHS COMPLIANT, PLASTIC, SOT23, 4 PIN

DNAS14TTEB 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:SOT-23
包装说明:TSSOP,针数:4
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.71
差分输出:NO接口集成电路类型:DIODE BUS TERMINATION ARRAY
JESD-30 代码:R-XDSO-G4JESD-609代码:e3
长度:2.92 mm湿度敏感等级:1
功能数量:1端子数量:4
最高工作温度:125 °C最低工作温度:-55 °C
封装主体材料:UNSPECIFIED封装代码:TSSOP
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260认证状态:Not Qualified
座面最大高度:1.15 mm表面贴装:YES
温度等级:MILITARY端子面层:MATTE TIN
端子形式:GULL WING端子节距:0.95 mm
端子位置:DUAL处于峰值回流温度下的最长时间:3
Base Number Matches:1

DNAS14TTEB 数据手册

 浏览型号DNAS14TTEB的Datasheet PDF文件第2页 
DN(X)  
diode terminator network  
EU  
features  
Fast reverse recovery time  
Low capacitance  
Fast turn on time  
SMD packages  
16 kV IEC61000-4-2 capable  
Products with lead-free terminations meet EU RoHS  
and China RoHS requirements  
applications  
Signal termination  
Signal conditioning  
ESD suppression  
Transient suppression  
dimensions and construction  
Dimensions inches (mm)  
S03  
S14  
Package Total  
Code Power  
L
L
Pins  
3
Pkg Ht  
L ±0.2 W ±0.2 p ±0.1  
d ±0.05  
P
±0.2  
p
Bonding  
Bonding  
Wire  
Wire  
.115  
.091  
(2.30)  
.075  
(1.91)  
.037  
(0.95)  
.017  
(0.43)  
S03 225mw  
(2.92)  
Lead  
Die  
Pad  
.115  
(2.92)  
.091  
(2.30)  
.075  
(1.91)  
.037  
(0.95)  
.017  
(0.43)  
S14 225mw  
S06 225mw  
N08 400mw  
W20 1200mw  
Q20 1000mw  
Q24 1000mw  
4
d
W
Lead  
W
Si  
Die  
Pad  
Wafer  
.115  
(2.92)  
.110  
(2.80)  
.037  
(0.95)  
.037  
(0.95)  
.017  
(0.43)  
d
Si  
Wafer  
6
Molded  
Resin  
Molded  
Resin  
.190  
(4.83)  
.236  
(5.99)  
.050  
(1.27)  
.063  
(1.60)  
.016  
(0.41)  
8
N08, W20,  
Q20, Q24  
S06  
.500  
(12.7)  
.408  
(10.36)  
.050  
(1.27)  
.084  
(2.40)  
.016  
(0.41)  
L
p
L
20  
20  
24  
Bonding  
Wire  
Bonding  
Wire  
.341  
(8.66)  
.236  
(5.99)  
.025  
(0.635)  
.063  
(1.60)  
.010  
(0.25)  
d
p
Lead  
.341  
(8.66)  
.236  
(5.99)  
.025  
(0.635)  
.063  
(1.60)  
.010  
(0.25)  
Lead  
W
W
Die  
Pad  
Wafer  
Die  
d
Si  
Pad  
Si  
Wafer  
Molded  
Resin  
Molded  
Resin  
circuit schematic  
1
1
1
1
DN3: 6 pins  
DN4: 4 pins  
DN2: 20 pins  
DNA: 20 pins  
1
1
1
1
DN6: 8 pins  
DN5: 24 pins  
DN8  
DN7: 24 pins  
For further information on packaging, please refer to Appendix A.  
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.  
3/03/08  
208  
KOA Speer Electronics, Inc. • Bolivar Drive • P.O. Box 547 • Bradford, PA 16701 • USA • 814-362-5536 • Fax: 814-362-8883 • www.koaspeer.com  

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