DN(X)
diode terminator network
EU
features
• Fast reverse recovery time
• Low capacitance
• Fast turn on time
• SMD packages
• 16 kV IEC61000-4-2 capable
• Products with lead-free terminations meet EU RoHS
and China RoHS requirements
applications
• Signal termination
• Signal conditioning
• ESD suppression
• Transient suppression
dimensions and construction
Dimensions inches (mm)
S03
S04
Package Total
L
L
Pins
3
Pkg Ht
Code Power
L
0.2
W
0.2
p
0.ꢀ
d 0.05
P
0.2
p
Bonding
Bonding
Wire
Wire
.115
(2.92)
.091
(2.30)
.075
(1.91)
.037
(0.95)
.017
(0.43)
S03 225mw
Lead
Die
Pad
.115
(2.92)
.091
(2.30)
.075
(1.91)
.037
(0.95)
.017
(0.43)
S04 225mw
S06 225mw
N08 400mw
Q20 ꢀ000mw
Q24 ꢀ000mw
4
d
W
Lead
W
Si
Die
Wafer
.037
(0.95)
.037
(0.95)
.017
(0.43)
Pad
.115
(2.92)
.110
(2.80)
d
Si
6
Wafer
Molded
Resin
Molded
Resin
.190
(4.83)
.236
(5.99)
.050
(1.27)
.063
(1.60)
.016
(0.41)
8
N08, Q20,
Q24
S06
.341
(8.66)
.236
(5.99)
.025
(0.635)
.063
(1.60)
.010
(0.25)
L
p
L
20
24
Bonding
Wire
Bonding
Wire
.341
(8.66)
.236
(5.99)
.025
(0.635)
.063
(1.60)
.010
(0.25)
d
p
Lead
Lead
W
W
Die
Pad
Wafer
Die
d
Si
Pad
Si
Molded
Resin
Wafer
Molded
Resin
circuit schematic
1
1
1
1
DN3: 6 pins
DN4: 4 pins
DN2: 20 pins
DNA: 20 pins
1
1
1
DN6: 8 pins
DN5: 24 pins
DN7: 24 pins
For further information on packaging, please refer to Appendix A.
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.
11/21/08
200
KOA Speer Electronics, Inc. • 199 Bolivar Drive • Bradford, PA 16701 • USA • 814-362-5536 • Fax: 814-362-8883 • www.koaspeer.com