DMN3061LCA3
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Drain-Source Voltage
Symbol
VDSS
Value
Unit
V
30
12
Gate-Source Voltage
V
VGSS
Steady
TA = +25°C
TA = +70°C
TA = +25°C
TA = +70°C
4.6
3.7
A
Continuous Drain Current (Note 5) VGS = 8V
State
ID
Steady
Continuous Drain Current (Note 5) VGS = 4.5V
State
4.4
3.5
A
A
ID
Pulsed Drain Current (Note 6)
20
IDM
Thermal Characteristics
Characteristic
Power Dissipation (Note 7)
Symbol
PD
Value
1.12
Unit
W
113.4
1.88
°C/W
W
Thermal Resistance, Junction to Ambient @TA = +25°C (Note 7)
Power Dissipation (Note 5)
RθJA
PD
66.4
°C/W
°C
Thermal Resistance, Junction to Ambient @TA = +25°C (Note 5)
Operating and Storage Temperature Range
RθJA
-55 to +150
TJ, TSTG
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 8)
Drain-Source Breakdown Voltage
Symbol
Min
Typ
Max
Unit
Test Condition
30
—
—
—
—
—
—
100
50
V
BVDSS
IDSS
VGS = 0V, ID = 250μA
VDS = 24V, VGS = 0V
VGS = 10V, VDS = 0V
nA
nA
Zero Gate Voltage Drain Current TJ = +25°C
Gate-Source Leakage
IGSS
ON CHARACTERISTICS (Note 8)
Gate Threshold Voltage
0.65
—
0.85
47
1.1
58
V
VGS(TH)
VDS = VGS, ID = 250μA
VGS = 8V, ID = 0.5A
VGS = 4.5V, ID = 0.5A
VGS = 2.5V, ID = 0.5A
VGS = 1.8V, ID = 0.5A
VGS = 0V, IS = 0.5A
—
54
62
Static Drain-Source On-Resistance
mΩ
RDS(ON)
—
71
110
160
0.9
—
—
104
0.7
2.4
7.1
Diode Forward Voltage
Reverse Recovery Charge
Reverse Recovery Time
DYNAMIC CHARACTERISTICS (Note 9)
Input Capacitance
—
V
VSD
QRR
tRR
—
nC
ns
VDD = 15V, IF = 0.5A,
di/dt = 300A/μs
—
—
—
—
—
—
—
—
—
—
—
—
—
—
126
81
—
—
—
—
—
—
—
—
—
—
—
—
Ciss
Coss
Crss
Rg
VDS = 15V, VGS = 0V,
f = 1.0MHz
Output Capacitance
pF
Reverse Transfer Capacitance
Series Gate Resistance
Total Gate Charge
4.5
3.7
1.4
0.2
0.2
0.2
4.3
1.9
9.1
5.1
Ω
f = 1MHz, VGS = 0V, VDS = 0V
Qg
Gate-Source Charge
Gate-Drain Charge
Qgs
VGS = 4.5V, VDS = 15V,
ID = 0.5A
nC
ns
Qgd
Qg(TH)
tD(ON)
tR
Gate Charge at VTH
Turn-On Delay Time
Turn-On Rise Time
VDS = 15V, VGS = 4.5V,
Turn-Off Delay Time
Rg = 2Ω, ID = 0.5A
tD(OFF)
tF
Turn-Off Fall Time
Notes:
5. Device mounted on FR-4 material with 1inch2 (6.45cm2), 2-oz. (0.071mm thick) Cu.
6. Repetitive rating, pulse width limited by junction temperature.
7. Device mounted on FR-4 PCB with minimum recommended pad layout, single sided.
8. Short duration pulse test used to minimize self-heating effect.
9. Guaranteed by design. Not subject to production testing.
2 of 7
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December 2020
© Diodes Incorporated
DMN3061LCA3
Document number: DS42490 Rev. 2 - 2