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DM2M32SJ6-15I PDF预览

DM2M32SJ6-15I

更新时间: 2024-11-09 20:20:51
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 动态存储器内存集成电路
页数 文件大小 规格书
20页 148K
描述
EDO DRAM Module, 2MX32, 15ns, CMOS, PSMA72,

DM2M32SJ6-15I 技术参数

是否Rohs认证: 不符合生命周期:Active
包装说明:SIMM, SSIM72Reach Compliance Code:compliant
风险等级:5.83最长访问时间:15 ns
I/O 类型:COMMONJESD-30 代码:R-PSMA-N72
内存密度:67108864 bit内存集成电路类型:EDO DRAM MODULE
内存宽度:32端子数量:72
字数:2097152 words字数代码:2000000
最高工作温度:85 °C最低工作温度:-40 °C
组织:2MX32输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:SIMM
封装等效代码:SSIM72封装形状:RECTANGULAR
封装形式:MICROELECTRONIC ASSEMBLY电源:5 V
认证状态:Not Qualified刷新周期:1024
座面最大高度:24.257 mm自我刷新:NO
最大待机电流:0.016 A子类别:DRAMs
最大压摆率:1.44 mA标称供电电压 (Vsup):5 V
表面贴装:NO技术:CMOS
温度等级:INDUSTRIAL端子形式:NO LEAD
端子节距:1.27 mm端子位置:SINGLE
Base Number Matches:1

DM2M32SJ6-15I 数据手册

 浏览型号DM2M32SJ6-15I的Datasheet PDF文件第2页浏览型号DM2M32SJ6-15I的Datasheet PDF文件第3页浏览型号DM2M32SJ6-15I的Datasheet PDF文件第4页浏览型号DM2M32SJ6-15I的Datasheet PDF文件第5页浏览型号DM2M32SJ6-15I的Datasheet PDF文件第6页浏览型号DM2M32SJ6-15I的Datasheet PDF文件第7页 
DM2M36SJ6/DM2M32SJ6 Multibank EDO  
2Mbx36/2Mbx32 Enhanced DRAM SIMM  
Product Specification  
Enhanced  
Memory Systems Inc.  
Features  
Architecture  
The DM2M36SJ6 achieves  
2Mb x 36 density by mounting  
18 1Mb x 4 EDRAMs, packaged  
in 28-pin plastic SOJ packages,  
on both sides of the multi-layer  
substrate. Sixteen DM2242 and  
two DM2252 devices provide  
data and parity storage. The  
DM2M32SJ6 contains 16  
DM2242 devices for data only.  
The EDRAM memory  
module architecture is very  
similar to a standard 8MB  
DRAM module with the addition  
of an integrated cache and on-  
16KByte SRAM Cache Memory for 12ns Random Reads Within Eight  
Active Pages (Multibank Cache)  
Fast DRAM Array for 30ns Access to Any New Page  
Write Posting Register for 12ns Random Writes and Burst Writes  
Within a Page (Hit or Miss)  
2KByte Wide DRAM to SRAM Bus for 113.6 Gigabytes/Sec Cache Fill  
On-chip Cache Hit/Miss Comparators Maintain Cache Coherency on Writes  
Hidden Precharge and Refresh Cycles  
Extended 64ms Refresh Period for Low Standby Power  
Standard CMOS/TTL Compatible I/O Levels and +5 or 3.3V Volt Supply  
Compatibility with JEDEC 2M x 36 DRAM SIMM Configuration  
Allows Performance Upgrade in System  
Multibank Extended Data Output (EDO) for Faster System Operation  
Low Power, Self Refresh Option  
Industrial Temperature Range Option  
chip control which allows it to  
Description  
operate much like an EDO DRAM.  
The Enhanced Memory Systems Multibank EDO 8MB EDRAM  
SIMM module provides a single memory module solution for the main  
memory or local memory of fast PCs, workstations, servers, and other  
high performance systems. Due to its fast 12ns cache row register,  
the EDRAM memory module supports zero-wait-state burst read  
operations at up to 83MHz bus rates in a non-interleave configuration  
and >132MHz bus rates with a two-way interleave configuration.  
On-chip write posting and fast page mode operation supports  
12ns write and burst write operations. On a cache miss, the fast  
DRAM array reloads the 2KByte cache over a 2KByte-wide bus in  
18ns for an effective bandwidth of 113.6 Gbytes/sec. This means  
very low latency and fewer wait states on a cache miss than a non-  
integrated cache/DRAM solution. The JEDEC compatible 72-bit  
SIMM configuration allows a single memory controller to be designed to  
support either JEDEC slow DRAMs or high speed EDRAMs to provide a  
simple upgrade path to higher system performance.  
The EDRAM’s SRAM cache is integrated into the DRAM array as  
tightly coupled row registers. Each EDRAM Bank has a total of four  
independent DRAM memory banks each with its own SRAM row  
register. Memory reads always occur from the cache row register of  
one of these banks as specified by row address bits A and A (bank  
select). When the internal comparator detects that the row address  
matches the last row read from any of the four DRAM banks (page  
hit), the SRAM is accessed and data is available on the output pins in  
12ns from the column address input. Subsequent reads within the  
page (burst reads or random reads) can continue at 12ns cycle  
time. When the row address does not match the last row read from  
any of the last four DRAM banks (page miss), the new DRAM row is  
accessed and loaded into the appropriate SRAM row register and  
data is available on the output pins all within 30ns from row enable.  
Subsequent reads within the page (burst reads or random reads)  
can continue at 12ns cycle time.  
2
9
Functional Diagram  
Since reads occur from the SRAM  
cache, the DRAM precharge can occur  
during burst reads. This eliminates the  
precharge time delay suffered by other  
DRAMs and SDRAMs when accessing a  
A
0-8  
Column  
Add  
Latch  
/CAL  
0-3,P  
Column Decoder  
4 - 512 x 36 Cache Pages  
(Row Registers) x 2  
8-Bit  
Comp  
new page. The EDRAM has an  
independent on-chip refresh counter and  
dedicated refresh control pin to allow the  
Sense Amps  
& Column Write Select  
/G  
I/O  
Control  
and  
Data  
Latches  
8 Last  
Row  
Read  
Add  
A
0-10  
DQ  
/S  
0-35  
DRAM array to be refreshed concurrently  
with cache read operations (hidden  
refresh).  
Memory writes are posted to the  
input data latch and directed to the DRAM  
array. During a write hit, the on-chip  
address comparator activates a parallel  
write path to the SRAM cache to maintain  
Latch  
0, 1  
Memory  
Array  
2048 x 512 x 36 x 2  
Row  
Add  
Latch  
/WE  
V
CC  
A
0-9  
C
1-18  
/F  
Row Add  
and  
Refresh  
Control  
V
SS  
Refresh  
Counter  
W/R  
/RE  
0,2,3  
© 1996 Enhanced Memory Systems Inc., 1850 Ramtron Drive, Colorado Springs, CO  
Telephone (800) 545-DRAM; Fax (719) 488-9095; http://www.csn.net/ramtron/enhanced  
80921  
38-2119-000  
The information contained herein is subject to change without notice.  
Enhanced reserves the right to change or discontinue this product without notice.  

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