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DIR-1B PDF预览

DIR-1B

更新时间: 2024-11-10 01:19:19
品牌 Logo 应用领域
华兴安 - HUAXINAN /
页数 文件大小 规格书
4页 435K
描述
Epoxy molded Dual-In-Line package

DIR-1B 数据手册

 浏览型号DIR-1B的Datasheet PDF文件第2页浏览型号DIR-1B的Datasheet PDF文件第3页浏览型号DIR-1B的Datasheet PDF文件第4页 
DIR  
Main Feature  
1. Epoxy molded Dual-In-Line package.  
2. Low profile, mounting space compatible with DIP IC.  
3. Completely washable.  
4. Provide high speed, miniature and cost effective  
switching solution.  
Contact Rating  
Load Type  
DIR/DID  
Rated Load (Resistive)  
Rated Carrying Current  
Max. Allowable Voltage  
Max. Allowable Current  
Max. Allowable Power Force  
Min. Switching Load  
Contact Material  
0.5A 100VDC  
0.2A 30VDC  
0.2A  
0.5A  
100 VDC  
0.5A  
30 VDC  
0.2A  
10 VA  
3 VA  
DC 1V, 1mA  
Ru Alloy  
SPST/DPST  
DC 1V, 1mA  
Ru Alloy  
SPDT  
Contact Form  
¢
Temperature Range:  
Application  
Operating .............................-40~85 °C.  
Storage ................................-55~125 °C.  
Humidity Range ...................45~85% RH.  
Vibration...............................20 G.  
Shock .................................100G.  
Life Expectancy:  
Security System, Modem and Telecommunication  
Products.  
¢
¢
¢
¢
Performance (at Initial Value)  
¢
Contact Resistance ............. 150 mMax.@  
100mA, 6VDC  
Electrical ..............................108 Operations at  
ref. 10VDC, 10mA  
¢
¢
¢
Operate Time ...................... 0.5 mSec. Max.  
Release Time ...................... 0.5 mSec. Max.  
Dielectric Strength:  
¢
Weight………………………..About 1.8g  
Safety Standard & File Number  
Between Coil & Contact ...... 1,400 VDC.  
4,000 VDC (4 Lead)  
¢
UL & C-UL............................E141060  
¢
Insulation Resistance: ......... 100 MMinimum  
Between Contacts ............... 200 VDC  

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