Datasheet > DIP-1987HT-02-1001JF

DIP-1987HT-02-1001JF

更新时间： 2024-11-09 06:53:11

品牌	Logo	应用领域
TTELEC		/
页数	文件大小	规格书
3页	512K
描述
TaNFilm® High Temperature DIP and SIP Networks

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TaNFilm^®High Temperature

DIP and SIP Networks

IRC Advanced Film Division

Ceramic sandwich construction with

high temperature epoxy encapsulent

1900HT / 4700HT SERIES

· Inherent reliability

Sputtered tantalum

nitride with passivation

oxide layer

· Custom conﬁgurations available

· Bonded leads not susceptible to solder reﬂow problems

· Absolute tolerence to ±0.1% - ratio accuracy to ±0.05%

· Absolute TCR to ±25 ppm/°C - ratio tracking to ±5ppm/°C

Thermo-compression

bonded leads provide

exceptional reliability

The IRC 1900HT and 4700HT Series is the ultimate combination of precision performance, reliability, and long term stability in a low

proﬁle,TaNFilm^®DIP and SIP packages. The rugged welded lead construction combined with the inherent passivation characteristics

of tantalum nitride ﬁlm insure superior continuous performance in high temperature applications over the installed life of the part.

Electrical Data

Rated Voltage

(not to exceed

rated power)

Package

Type

Ohmic

Range

Package Element

Temperature

Range

Size

Schematic

Power

Isolated

Schematic A

100Ω to 100KΩ

1.00KΩ to 50KΩ

100Ω to 100KΩ

1.00KΩ to 50KΩ

50Ω to 50KΩ

1.12W

Bussed

Schematic B

DIP

0.08W

100V

Isolated

Schematic A

1.28W

0.24W

0.32W

Bussed

Schematic B

-55°C to +200°C

Isolated

Schematic G

Bussed

Schematic C

2.00KΩ to 25KΩ

50Ω to 50KΩ

SIP

0.08W

50V

Isolated

Schematic G

Bussed

Schematic C

2.00KΩ to 25KΩ

General Note

IRC reserves the right to make changes in product speciﬁcation without notice or liability.

All information is subject to IRC’s own data and is considered accurate at time of going to print.

A subsidiary of

TT electronics plc

Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com

HT Series Issue November 2008 Sheet 1 of 3

12 3

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