是否无铅: | 不含铅 | 生命周期: | Active |
零件包装代码: | QLCC | 包装说明: | QCCJ, LDCC28,.5SQ |
针数: | 28 | Reach Compliance Code: | unknown |
HTS代码: | 8542.39.00.01 | 风险等级: | 0.8 |
模拟集成电路 - 其他类型: | SINGLE-ENDED MULTIPLEXER | JESD-30 代码: | S-PQCC-J28 |
JESD-609代码: | e3 | 长度: | 11.5062 mm |
湿度敏感等级: | 1 | 负电源电压最大值(Vsup): | -20 V |
负电源电压最小值(Vsup): | -5 V | 标称负供电电压 (Vsup): | -15 V |
信道数量: | 16 | 功能数量: | 1 |
端子数量: | 28 | 标称断态隔离度: | 69 dB |
通态电阻匹配规范: | 5 Ω | 最大通态电阻 (Ron): | 100 Ω |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | QCCJ |
封装等效代码: | LDCC28,.5SQ | 封装形状: | SQUARE |
封装形式: | CHIP CARRIER | 峰值回流温度(摄氏度): | NOT SPECIFIED |
电源: | 12/+-15 V | 认证状态: | Not Qualified |
座面最大高度: | 4.57 mm | 最大信号电流: | 0.03 A |
子类别: | Multiplexer or Switches | 最大供电电压 (Vsup): | 20 V |
最小供电电压 (Vsup): | 5 V | 标称供电电压 (Vsup): | 15 V |
表面贴装: | YES | 最长断开时间: | 300 ns |
最长接通时间: | 400 ns | 切换: | BREAK-BEFORE-MAKE |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | Matte Tin (Sn) | 端子形式: | J BEND |
端子节距: | 1.27 mm | 端子位置: | QUAD |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 11.5062 mm |
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