Datasheet > DFLS140L

DFLS140L

更新时间： 2024-11-21 03:29:23

品牌	Logo	应用领域
美台 - DIODES		/
页数	文件大小	规格书
3页	72K
描述
1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER

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DFLS140L 数据手册

SPICE MODEL: DFLS140L

DFLS140L

1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER

Features

Guard Ring Die Construction for Transient Protection

Low Power Loss, High Efficiency

High Surge Capability

PowerDI 123

High Current Capability and Low Forward Voltage Drop

Lead Free Finish, RoHS Compliant (Note 4)

"Green" Molding Compound (No Br, Sb)

Dim Min

Max

Typ

3.65

3.75

3.70

2.775 2.825 2.80

1.750 1.800 1.775

0.955 1.000 0.98

Qualified to AEC-Q101 Standards for High Reliability

Mechanical Data

Case: PowerDI^ä123

0.95

0.15

0.60

—

1.05

0.25

0.70

—

1.00

0.20

0.65

1.36

1.10

0.20

1.05

Case Material: Molded Plastic, “Green” Molding

Compound. UL Flammability Classification Rating 94V-0

Moisture Sensitivity: Level 1 per J-STD-020C

Terminal Connections: Cathode Band

—

Terminals: Finish – Matte Tin annealed over Copper

leadframe. Solderable per MIL-STD-202,

—

Method 208

0.95

1.25

Marking & Type Code Information: See Page 3

Weight: 0.096 grams (approx.)

All Dimensions in mm

Ordering Information: See Last Page

@ T_A= 25°C unless otherwise specified

Maximum Ratings

Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%.

Characteristic

Symbol

Value

Unit

V_RRM

V_RWM

V_R

Peak Repetitive Reverse Voltage

Working Peak Reverse Voltage

DC Blocking Voltage

V_R(RMS)

I_F(AV)

RMS Reverse Voltage

Average Forward Current @ T_T= 120°C

1.0

Non-Repetitive Peak Forward Surge Current 8.3ms

single half sine-wave superimposed on rated load

I_FSM

T_j

Operating Temperature Range

Storage Temperature Range

-55 to +125

-55 to +150

°C

T_STG

°C

@ T_A= 25°C unless otherwise specified

Thermal Characteristics

Characteristic

Power Dissipation (Note 1)

Symbol

P_D

Value

1.67

556

Unit

P_D

Power Dissipation (Note 2)

R_qJA

R_qJS

Thermal Resistance Junction to Ambient (Note 1)

Thermal Resistance Junction to Ambient (Note 2)

Thermal Resistance Junction to Soldering (Note 3)

°C/W

180

Notes: 1. Part mounted on 50.8mm X 50.8mm GETEK board with 25.4mm X 25.4mm copper pad, 25% anode, 75% cathode.

2. Part mounted on FR-4 board with 1.8mm X 2.5mm cathode and 1.8mm X 1.2mm anode, 1 oz. copper pads.

3. Theoretical R

calculated from the top center of the die straight down to the PCB cathode tab solder junction.

4. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see EU Directive Annex Notes 5 and 7.

qJS

DS30490 Rev. 2 - 2

1 of 3

DFLS140L

PowerDI is a trademark of Diodes Incorporated.

www.diodes.com

ã Diodes Incorporated

12 3

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