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DFLS230L

更新时间： 2024-11-21 03:29:23
品牌 Logo 应用领域
美台 - DIODES /
页数 文件大小 规格书
3页 73K
描述
2.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER

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中文翻译

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DFLS230L 数据手册

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SPICE MODEL: DFLS230L  
DFLS230L  
2.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER  
ä
PowerDI 123  
Features  
·
Guard Ring Die Construction for  
Transient Protection  
ä
PowerDI 123  
·
·
·
·
·
Low Power Loss, High Efficiency  
High Surge Capability  
Dim Min  
Max  
3.90  
3.00  
1.93  
1.00  
1.25  
0.25  
0.85  
—
Typ  
3.70  
2.80  
1.78  
0.98  
1.00  
0.20  
0.65  
1.35  
1.10  
0.20  
1.05  
D
High Current Capability and Low Forward Voltage Drop  
Lead Free Finish, RoHS Compliant (Note 5)  
"Green" Molding Compound (No Br, Sb)  
A
B
3.50  
2.60  
1.63  
0.93  
0.85  
0.15  
0.45  
—
H
A
B
C
D
Mechanical Data  
·
E
Case: PowerDIä123  
C
E
H
·
Case Material: Molded Plastic, "Green" Molding Compound.  
UL Flammability Classification Rating 94V-0  
L
L
L1  
L
·
·
·
Moisture sensitivity: Level 1 per J-STD-020C  
Terminal Connections: Cathode Band  
L1  
L2  
L3  
L4  
—
—
Terminals: Finish – Matte Tin annealed over Copper  
E
L2  
—
—
e
3
leadframe. Solderable per MIL-STD-202, Method 208  
Marking & Type Code Information: See Last Page  
Weight: 0.01 grams (approx.)  
0.90  
1.30  
L3  
L4  
·
·
·
A
All Dimensions in mm  
Ordering Information: See Last Page  
@ TA = 25°C unless otherwise specified  
Maximum Ratings  
Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%.  
Characteristic  
Symbol  
Value  
Unit  
VRRM  
VRWM  
VR  
Peak Repetitive Reverse Voltage  
Working Peak Reverse Voltage  
DC Blocking Voltage  
30  
V
VR(RMS)  
IF(AV)  
RMS Reverse Voltage  
21  
V
A
Average Forward Current @ TT = 121°C  
2.0  
Non-Repetitive Peak Forward Surge Current 8.3ms  
single half sine-wave superimposed on rated load  
(JEDEC Method)  
IFSM  
33  
A
PD  
PD  
Power Dissipation (Note 1)  
1.67  
556  
W
Power Dissipation (Note 2)  
mW  
°C/W  
°C/W  
°C/W  
°C  
RqJA  
RqJA  
RqJS  
Tj  
Thermal Resistance Junction to Ambient (Note 1)  
Thermal Resistance Junction to Ambient (Note 2)  
Thermal Resistance Junction to Soldering (Note 3)  
Operating Temperature Range  
60  
180  
10  
-40 to +125  
-40 to +150  
TSTG  
Storage Temperature Range  
°C  
@ TA = 25°C unless otherwise specified  
Electrical Characteristics  
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
Test Condition  
IR = 1.0mA  
V(BR)R  
Reverse Breakdown Voltage (Note 4)  
30  
¾
¾
V
IF = 1.0A  
IF = 2.0A  
¾
¾
0.310  
0.375  
¾
0.420  
VF  
Forward Voltage (Note 4)  
V
V
R = 5V, TA = 25°C  
¾
¾
0.260  
¾
¾
1.0  
IR  
Leakage Current (Note 4)  
Total Capacitance  
mA  
pF  
VR = 30V, TA = 25°C  
CT  
VR = 10V, f = 1.0MHz  
¾
76  
¾
Notes:  
1. Part mounted on 2"x2" GETEK board with 1"x1" copper pad, 25% anode, 75% cathode.  
2. Part mounted on FR-4 board with recommended pad layout, which can be found on our website  
at http://www.diodes.com/datasheets/ap02001.pdf.  
3. Theoretical R  
calculated from the top center of the die straight down to the PCB/cathode tab solder junction.  
qJS  
4. Short duration pulse test to minimize self-heating effect.  
5. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see EU Directive Annex Notes 5 and 7.  
DS30515 Rev. 1 - 1  
1 of 3  
DFLS230L  
PowerDI is a trademark of Diodes Incorporated.  
www.diodes.com  
ã Diodes Incorporated  
123

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