DB3A

更新时间： 2024-11-17 09:59:59

品牌	Logo	应用领域
美微科 - MCC		数据判读及分析中心
页数	文件大小	规格书
3页	170K
描述
SILICON BIDIRECTIONAL DIAC

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中文翻译

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数据手册

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DB3A 数据手册

M C C

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20736 Marilla Street Chatsworth

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ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ

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DB3A

Micro Commercial Components

Features

SILICON

BIDIRECTIONAL

DIAC

The three layer, two terminal, axial lead, hermetically sealed

diacs are designed specifically for triggering thyristors.

Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates

Compliant. See ordering information)

RoHS

High temperature soldering guaranteed

250 C/10 seconds,0.375" (9.5mm) lead length,

Epoxy meets UL 94 V-0 flammability rating

Moisture Sensitivity Level 1

A-405

Maximum Ratings

ꢀ

Operating Temperature: -40^oC to +110^oC

Storage Temperature: -40^oC to +125^oC

Electrical Characteristics @ 25^oC Unless Otherwise Specified

Power dissipation

on Printed

P_C

150mW

Circuit(l=10mm)

Repetitive Peak

on-state Current

DB3,DC34,DB4

DB6

T_A=65^oC

I_TRM

2.0A

16A

t_p=10us,f=100Hz

C=22nF(Note 3)

Breakover Voltage

Min Typ Max

28 32 36V

V_BO

Breakover Voltage

Symmetry

|+V_BO|

-|-V_BO|

C=22nF(Note 3)

DIMENSIONS

INCHES

MIN

.166

.080

---

MIN

DIM

MAX

.205

.107

.024

---

MAX

5.20

2.70

.60

NOTE

4.10

2.00

---

Output

Voltage(Note 2)

Breakover

Current(Note 2)

Rise Time(Note 2)

Leakage

V_o(min)

1.000

25.40

---

I_BO(max)

T_r

100uA

1.5us

10uA

C=22nF

I_B(max)

V_B=0.5V_BO(max)

Current(Note 2)

Note: 1.

High Temperature Solder Exemption Applied, see EU Directive Annex 7.

2. Electrical characteristics applicable in both forward and

reverse directions.

3. Connected in parallel with the devices.

w w w.m c c s e m i.c o m

Revision: A

2011/05/12

1 of 3

12 3

中文翻译

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