是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Obsolete | 零件包装代码: | BGA |
包装说明: | BGA, | 针数: | 456 |
Reach Compliance Code: | compliant | HTS代码: | 8542.31.00.01 |
风险等级: | 5.92 | JESD-30 代码: | S-PBGA-B456 |
JESD-609代码: | e0 | 长度: | 35 mm |
端子数量: | 456 | 最高工作温度: | 70 °C |
最低工作温度: | 封装主体材料: | PLASTIC/EPOXY | |
封装代码: | BGA | 封装形状: | SQUARE |
封装形式: | GRID ARRAY | 峰值回流温度(摄氏度): | 225 |
认证状态: | Not Qualified | 座面最大高度: | 2.46 mm |
最大供电电压: | 3.63 V | 最小供电电压: | 2.97 V |
标称供电电压: | 3.3 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | COMMERCIAL |
端子面层: | TIN LEAD | 端子形式: | BALL |
端子节距: | 1.27 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | 30 | 宽度: | 35 mm |
uPs/uCs/外围集成电路类型: | MICROPROCESSOR CIRCUIT | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
CYPSI2G100SP456-1MGC | CYPRESS |
获取价格 |
Microprocessor Circuit, CMOS, PBGA456, 35 X 35 MM, 2.33 MM HEIGHT, BGA-456 | |
CYPSI2G50P456-1MGC | CYPRESS |
获取价格 |
Microprocessor Circuit, CMOS, PBGA456, 35 X 35 MM, 2.33 MM HEIGHT, BGA-456 | |
CYPSI2G50SP456-1MGC | CYPRESS |
获取价格 |
Microprocessor Circuit, CMOS, PBGA456, 35 X 35 MM, 2.33 MM HEIGHT, BGA-456 | |
CYPSI5G100P456-1MGC | CYPRESS |
获取价格 |
Microprocessor Circuit, CMOS, PBGA456, 35 X 35 MM, 2.33 MM HEIGHT, BGA-456 | |
CYPSI5G100SP456-1MGC | CYPRESS |
获取价格 |
Microprocessor Circuit, CMOS, PBGA456, 35 X 35 MM, 2.33 MM HEIGHT, BGA-456 | |
CYPT1049DV33-12FZMB | INFINEON |
获取价格 |
Asynchronous SRAM | |
CYPT1542AV18-250GCMB | INFINEON |
获取价格 |
Synchronous SRAM | |
CYPT1543AV18-250GCMB | INFINEON |
获取价格 |
Synchronous SRAM | |
CYPT1544AV18-250GCMB | INFINEON |
获取价格 |
Synchronous SRAM | |
CYPT1545AV18-250GCMB | INFINEON |
获取价格 |
Synchronous SRAM |