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CY9C62256-70SNXI PDF预览

CY9C62256-70SNXI

更新时间: 2024-11-27 21:16:31
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 光电二极管内存集成电路
页数 文件大小 规格书
11页 368K
描述
Memory Circuit, 32KX8, CMOS, PDSO28, 0.300 INCH, SOIC-28

CY9C62256-70SNXI 技术参数

是否无铅: 含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:SOIC
包装说明:SOP,针数:28
Reach Compliance Code:compliantHTS代码:8542.32.00.71
风险等级:5.84JESD-30 代码:R-PDSO-G28
JESD-609代码:e4长度:17.9324 mm
内存密度:262144 bit内存集成电路类型:MEMORY CIRCUIT
内存宽度:8湿度敏感等级:3
功能数量:1端子数量:28
字数:32768 words字数代码:32000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:32KX8
封装主体材料:PLASTIC/EPOXY封装代码:SOP
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260认证状态:Not Qualified
座面最大高度:2.794 mm最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):4.5 V标称供电电压 (Vsup):5 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:NICKEL PALLADIUM GOLD
端子形式:GULL WING端子节距:1.27 mm
端子位置:DUAL处于峰值回流温度下的最长时间:20
宽度:7.5057 mmBase Number Matches:1

CY9C62256-70SNXI 数据手册

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PRELIMINARY  
CY9C62256  
32K x 8 Magnetic Nonvolatile CMOS RAM  
Features  
Functional Description  
• 100% form, fit, function-compatible with 32K × 8  
The CY9C62256 is a high-performance CMOS nonvolatile  
RAM employing an advanced magnetic RAM (MRAM)  
process. An MRAM is nonvolatile memory that operates as a  
fast read and write RAM. It provides data retention for more  
than ten years while eliminating the reliability concerns,  
functional disadvantages and system design complexities of  
battery-backed SRAM, EEPROM, Flash and FeRAM. Its fast  
writes and high write cycle endurance makes it superior to  
other types of nonvolatile memory.  
micropower SRAM (CY62256)  
— Fast Read and Write access: 70 ns  
— Voltage range: 4.5V–5.5V operation  
— Low power: 330 mW Active; 495 µW standby  
— Easy memory expansion with CE and OE features  
— TTL-compatible inputs and outputs  
— Automatic power-down when deselected  
The CY9C62256 operates very similarly to SRAM devices.  
Memory read and write cycles require equal times. The MRAM  
memory is nonvolatile due to its unique magnetic process.  
Unlike BBSRAM, the CY9C62256 is truly a monolithic nonvol-  
atile memory. It provides the same functional benefits of a fast  
write without the serious disadvantages associated with  
modules and batteries or hybrid memory solutions.  
These capabilities make the CY9C62256 ideal for nonvolatile  
memory applications requiring frequent or rapid writes in a  
bytewide environment.  
• Replaces 32K × 8 Battery Backed (BB)SRAM, SRAM,  
EEPROM, FeRAM or Flash memory  
• Data is automatically Write protected during power loss  
• Write Cycles Endurance: > 1015 cycles  
• Data Retention: > 10 Years  
• Shielded from external magnetic fields  
• Extra 64 Bytes for device identification and tracking  
• Temperature ranges  
The CY9C62256 is offered in both commercial and industrial  
temperature ranges.  
— Commercial: 0°C to 70°C  
— Industrial: – 40°C to 85°C  
• JEDEC STD 28-pin (300-mil) SOIC, and 28-pin TSOP-1  
packages. Also available in 450-mil wide (300-mil body  
width) 28-pin narrow SOIC.  
Logic Block Diagram  
Pin Configurations  
SOIC  
Top View  
A
28  
V
CC  
1
5
27 WE  
A
2
6
A
26  
A
3
7
4
A
A
4
25  
3
8
9
24  
A
A
5
2
A
10  
A
11  
A
12  
A
13  
A
14  
23  
22  
A
6
1
OE  
7
A
0
21  
20  
19  
18  
17  
8
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
0
1
2
3
4
5
6
CE  
I/O  
9
INPUTBUFFER  
10  
11  
12  
13  
14  
7
I/O  
I/O  
A
I/O  
I/O  
I/O  
6
5
4
3
11  
0
1
2
A
10  
A
16 I/O  
9
Silicon Sig.  
I/O  
GND  
15  
A
8
A
7
512x512  
ARRAY  
A
6
21  
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
10  
9
8
A
OE  
22  
23  
0
A
3
2
1
A
1
CE  
A
I/O  
A
2
24  
25  
26  
27  
28  
1
2
3
4
5
7
A
I/O  
I/O  
I/O  
I/O  
A
3
6
5
4
3
A
4
TSOP I  
WE  
CE  
POWER  
DOWN &  
WRITE  
Top View  
V
WE  
CC  
COLUMN  
GND  
A
5
(not to scale)  
DECODER  
I/O  
2
PROTECT  
A
6
I/O  
7
OE  
I/O  
1
A7  
I/O  
0
A
8
A
A
14  
9
A
A
A
13  
6
7
10  
11  
A
12  
Cypress Semiconductor Corporation  
3901 North First Street  
San Jose, CA 95134  
408-943-2600  
Document#: 38-15001 Rev. *F  
Revised March 21, 2005  

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