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CY8C20646AS-24LQXI

更新时间： 2024-02-14 15:22:26
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赛普拉斯 - CYPRESS 控制器
页数 文件大小 规格书
51页 782K
描述
1.8 V Programmable CapSense® Controller with SmartSense™ Auto-tuning 1–33 Buttons, 0–6 Sliders

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CY8C20646AS-24LQXI 数据手册

 浏览型号CY8C20646AS-24LQXI的Datasheet PDF文件第45页浏览型号CY8C20646AS-24LQXI的Datasheet PDF文件第46页浏览型号CY8C20646AS-24LQXI的Datasheet PDF文件第47页浏览型号CY8C20646AS-24LQXI的Datasheet PDF文件第48页浏览型号CY8C20646AS-24LQXI的Datasheet PDF文件第50页浏览型号CY8C20646AS-24LQXI的Datasheet PDF文件第51页 
CY8C20XX6A/S  
Document History Page (continued)  
DocumentTitle:CY8C20XX6A/S, 1.8VProgrammableCapSense® ControllerwithSmartSense™Auto-tuning1–33Buttons,  
0–6 Sliders  
Document Number: 001-54459  
Orig. of  
Change  
Submission  
Date  
Revision  
ECN  
Description of Change  
*G  
3247491 TTO/JPM/  
ARVM / BVI  
06/16/11  
Add 4 new parameters to Table 14 on page 21, and 2 new parameters to Table  
15 on page 22.  
Changed Typ values for the following parameters: I  
I
I
V
DD24, DD12, DD6, OSLPC.  
Added footnote # 40 and referred it to pin numbers 1, 14, 15, 42, and 43 under  
Table 10 on page 18.  
Added footnote # 43 and referred it to parameter V  
under Table 11 on page 19.  
IOZ  
Added “t  
” parameter to Table 27 on page 27.  
JIT_IMO  
Included footnote # 59 and added reference to t  
27 on page 27.  
specification under Table  
JIT_IMO  
Updated Solder Reflow Specifications on page 37 as per specs 25-00090 and  
25-00103.  
I
Max value changed from 0.5 µA to 1.1 µA in Table 13 on page 20.  
SB0  
Added Table 26 on page 26.  
Updated part numbers for “SmartSense_EMC” enabled CapSense controller.  
”
*H  
*I  
3367332  
3371807  
BTK /  
SSHH /  
JPM/TTO/  
VMAD  
09/09/11  
Added parameter “t  
Added parameter “I  
to Table 27 on page 27.  
” to Table 13 on page 20.  
OS  
SBI2C  
Added Table 24 on page 26.  
Added Table 25 on page 26.  
Replaced text “Port 2 or 3 pins” with “Port 2 or 3 or 4 pins” in Table 14, Table 15,  
Table 16, and Table 28.  
MATT  
09/30/2011 Updated Packaging Information (Updated the next revision package outline for  
Figure 20, Figure 23 and included a new package outline Figure 25).  
Updated Ordering Information (Added new part numbers  
CY8C20636A-24LQXI, CY8C20636A-24LQXIT, CY8C20646A-24LQXI,  
CY8C20646A-24LQXIT, CY8C20666A-24LQXI, CY8C20666A-24LQXIT,  
CY8C20666AS-24LQXI, CY8C20666AS-24LQXIT, CY8C20646AS-24LQXI  
and CY8C20646AS-24LQXIT).  
Updated in new template.  
*J  
3401666  
3414479  
MATT  
KPOL  
10/11/2011 No technical updates.  
*K  
10/19/2011 Removed clock stretching feature on page 1.  
2
Removed I C enhanced slave interface point from Additional System  
Resources.  
*L  
3452591 BVI / UDYG 12/01/2011 Changed document title.  
Updated DC Chip-Level Specifications table.  
Updated Solder Reflow Specifications section.  
Updated Getting Started and Designing with PSoC Designer sections.  
Included Development Tools section.  
Updated Software under Development Tool Selection section.  
*M  
*N  
3473330  
3587003  
ANBA  
DST  
12/22/2011 Updated DC Chip-Level Specifications under Electrical Specifications (updated  
maximum value of I  
parameter from 1.1 µA to 1.05 µA).  
SB0  
04/16/2012 Added note for WLCSP package on page 1.  
Added Sensing inputs to pin table captions.  
Updated Conditions for DC Reference Buffer Specifications.  
Updated t  
Added note for t  
description in AC Chip-Level Specifications.  
JIT_IMO  
, t  
, t  
, and t  
specs.  
VDDWAIT VDDXRES ACQ  
XRESINI  
Removed WLCSP package outline.  
*O  
3638569  
BVI  
06/06/2012 Updated F  
parameter in the Table 36, “SPI Slave AC Specifications,” on  
SCLK  
page 33.  
Changed t  
page 32.  
to t  
in Table 35, “SPI Master AC Specifications,” on  
OUT_H  
OUT_HIGH  
Updated package diagram 001-57280 to *C revision.  
Document Number: 001-54459 Rev. *T  
Page 49 of 51  
1...464748495051

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