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CY7C25682KV18-550BZXI PDF预览

CY7C25682KV18-550BZXI

更新时间: 2024-11-07 14:56:23
品牌 Logo 应用领域
英飞凌 - INFINEON 双倍数据速率
页数 文件大小 规格书
29页 873K
描述
DDR-II+ CIO

CY7C25682KV18-550BZXI 数据手册

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CY7C25682KV18  
CY7C25702KV18  
72-Mbit DDR II+ SRAM Two-Word Burst Architecture  
(2.5 Cycle Read Latency) with ODT  
72-Mbit DDR II+ SRAM Two-Word Burst Architecture (2.5 Cycle Read Latency) with ODT  
Features  
Configurations  
72-Mbit density (4M × 18, 2M × 36)  
With Read Cycle Latency of 2.5 cycles:  
CY7C25682KV18 – 4M × 18  
550 MHz clock for high bandwidth  
CY7C25702KV18 – 2M × 36  
Two-word burst for reducing address bus frequency  
Double data rate (DDR) interfaces (data transferred at  
1100 MHz) at 550 MHz  
Functional Description  
The CY7C25682KV18, and CY7C25702KV18 are 1.8 V  
Synchronous Pipelined SRAMs equipped with DDR II+  
architecture. The DDR II+ consists of an SRAM core with  
advanced synchronous peripheral circuitry. Addresses for read  
and write are latched on alternate rising edges of the input (K)  
clock. Write data is registered on the rising edges of both K and  
K. Read data is driven on the rising edges of K and K. Each  
address location is associated with two 18-bit words  
(CY7C25682KV18), or 36-bit words (CY7C25702KV18) that  
burst sequentially into or out of the device.  
Available in 2.5 clock cycle latency  
Two input clocks (K and K) for precise DDR timing  
SRAM uses rising edges only  
Echo Clocks (CQ and CQ) simplify data capture in high speed  
systems  
Data valid pin (QVLD) to indicate valid data on the output  
On-die termination (ODT) feature  
Supported for D[x:0], BWS[x:0], and K/K inputs  
These devices have an On-Die Termination feature supported  
for D[x:0], BWS[x:0], and K/K inputs, which helps eliminate  
external termination resistors, reduce cost, reduce board area,  
and simplify board routing.  
Synchronous internally self-timed writes  
DDR II+ operates with 2.5 cycle read latency when DOFF is  
asserted HIGH  
Asynchronous inputs include an output impedance matching  
input (ZQ). Synchronous data outputs (Q, sharing the same  
physical pins as the data inputs D) are tightly matched to the two  
output echo clocks CQ/CQ, eliminating the need for separately  
capturing data from each individual DDR SRAM in the system  
design.  
Operates similar to DDR I Device with 1 cycle read latency  
when DOFF is asserted LOW  
[1]  
Core VDD = 1.8 V ± 0.1 V; I/O VDDQ = 1.4 V to VDD  
Supports both 1.5 V and 1.8 V I/O supply  
All synchronous inputs pass through input registers controlled by  
the K or K input clocks. All data outputs pass through output  
registers controlled by the K or K input clocks. Writes are  
conducted with on-chip synchronous self-timed write circuitry.  
HSTL inputs and variable drive HSTL output buffers  
Available in 165-ball FBGA package (13 × 15 × 1.4 mm)  
Offered in both Pb-free and non Pb-free packages  
JTAG 1149.1 compatible test access port  
For a complete list of related documentation, click here.  
Phase-locked loop (PLL) for accurate data placement  
Selection Guide  
Description  
Maximum Operating Frequency  
Maximum Operating Current  
550 MHz  
550  
500 MHz  
500  
450 MHz  
450  
400 MHz Unit  
400  
590  
750  
MHz  
mA  
× 18  
× 36  
760  
700  
650  
970  
890  
820  
Note  
1. The Cypress QDR II+ devices surpass the QDR consortium specification and can support V  
= 1.4 V to V  
.
DD  
DDQ  
Cypress Semiconductor Corporation  
Document Number: 001-66483 Rev. *F  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised March 11, 2016  

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