Datasheet > CY7C1381B-83AI

CY7C1381B-83AI

更新时间： 2024-11-27 03:57:43

品牌	Logo	应用领域
赛普拉斯 - CYPRESS		静态存储器
页数	文件大小	规格书
31页	599K
描述
512 】 36/1M 】 18 Flow-Thru SRAM

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中文翻译

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CY7C1381B-83AI 数据手册

381B

CY7C1381B

CY7C1383B

512 × 36/1M × 18 Flow-Thru SRAM

internal burst operation. All synchronous inputs are gated by

registers controlled by a positive-edge-triggered clock input

(CLK). The synchronous inputs include all addresses, all data

inputs, address-pipelining Chip Enable (CE), Burst Control

Inputs (ADSC, ADSP, and ADV), Write Enables (BWa, BWb,

BWc, BWd, and BWe), and Global Write (GW).

Features

• Fast access times: 7.5, 8.5, 10.0 ns

• Fast clock speed: 117, 100, 83 MHz

• Provide high-performance 3-1-1-1 access rate

• Optimal for depth expansion

Asynchronous inputs include the Output Enable (OE) and

Burst Mode Control (MODE). The data outputs (Q), enabled

by OE, are also asynchronous.

• 3.3V (–5% / +10%) power supply

• Common data inputs and data outputs

• Byte Write Enable and Global Write control

• Chip enable for address pipeline

• Address, data and control registers

• Internally self-timed Write Cycle

Addresses and chip enables are registered with either

Address Status Processor (ADSP) or address status controller

(ADSC) input pins. Subsequent burst addresses can be inter-

nally generated as controlled by the Burst Advance Pin (ADV).

• Burst control pins (interleaved or linear burst

Address, data inputs, and Write controls are registered on-chip

to initiate self-timed Write cycle. Write cycles can be one to

sequence)

• Automatic power down available using ZZ mode or CE

deselect

• High-density, high-speed packages

• JTAG boundary scan for BGA packaging version

four bytes wide as controlled by the Write control inputs.

Individual byte Write allows individual byte to be written. BWa

controls DQ1-DQ8 and DP1. BWb controls DQ9-DQ16 and

DP2. BWc controls DQ17-DQ24and DP3. BWd controls

DQ25-DQ32 and DP4. BWa, BWb BWc, and BWd can be

active only with BWe being LOW. GW being LOW causes all

bytes to be written. Write pass-through capability allows

written data available at the output for the immediately next

Read cycle. This device also incorporates pipelined enable

circuit for easy depth expansion without penalizing system

performance.

Functional Description

The Cypress Synchronous Burst SRAM family employs

high-speed, low power CMOS designs using advanced

single-layer polysilicon, triple-layer metal technology. Each

memory cell consists of six transistors.

The CY7C1381B and CY7C1383B SRAMs integrate

524,288 × 36 and 1,048,576 × 18 SRAM cells with advanced

synchronous peripheral circuitry and a 2-bit counter for

All inputs and outputs of the CY7C1381B and the CY7C1383B

are JEDEC-standard JESD8-5-compatible.

Selection Guide

117 MHz

100 MHz

8.5

83 MHz

10.0

185

Unit

Maximum Access Time

7.5

250

Maximum Operating Current

Maximum CMOS Standby Current

225

Cypress Semiconductor Corporation

•

3901 North First Street

•

San Jose

•

CA 95134

•

408-943-2600

Document #: 38-05196 Rev. **

Revised December 3, 2001

12 3 4 5 6 7...31

中文翻译

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与CY7C1381B-83AI相关器件

型号	品牌	获取价格	描述	数据表
CY7C1381B-83BGC	CYPRESS	获取价格	512 】 36/1M 】 18 Flow-Thru SRAM
CY7C1381B-83BGI	CYPRESS	获取价格	512 】 36/1M 】 18 Flow-Thru SRAM
CY7C1381B-83BZC	CYPRESS	获取价格	512 】 36/1M 】 18 Flow-Thru SRAM
CY7C1381B-83BZI	CYPRESS	获取价格	512 】 36/1M 】 18 Flow-Thru SRAM
CY7C1381BV25	ETC	获取价格	Memory
CY7C1381BV25-100AC	CYPRESS	获取价格	Standard SRAM, 512KX36, 8.5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-10
CY7C1381BV25-100AI	CYPRESS	获取价格	Standard SRAM, 512KX36, 8.5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-10
CY7C1381BV25-100BGC	CYPRESS	获取价格	Standard SRAM, 512KX36, 8.5ns, CMOS, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, FBGA-119
CY7C1381BV25-100BGI	CYPRESS	获取价格	Standard SRAM, 512KX36, 8.5ns, CMOS, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119
CY7C1381BV25-100BZC	CYPRESS	获取价格	Standard SRAM, 512KX36, 8.5ns, CMOS, PBGA165, 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165

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