381B
CY7C1381B
CY7C1383B
512 × 36/1M × 18 Flow-Thru SRAM
internal burst operation. All synchronous inputs are gated by
registers controlled by a positive-edge-triggered clock input
(CLK). The synchronous inputs include all addresses, all data
inputs, address-pipelining Chip Enable (CE), Burst Control
Inputs (ADSC, ADSP, and ADV), Write Enables (BWa, BWb,
BWc, BWd, and BWe), and Global Write (GW).
Features
• Fast access times: 7.5, 8.5, 10.0 ns
• Fast clock speed: 117, 100, 83 MHz
• Provide high-performance 3-1-1-1 access rate
• Optimal for depth expansion
Asynchronous inputs include the Output Enable (OE) and
Burst Mode Control (MODE). The data outputs (Q), enabled
by OE, are also asynchronous.
• 3.3V (–5% / +10%) power supply
• Common data inputs and data outputs
• Byte Write Enable and Global Write control
• Chip enable for address pipeline
• Address, data and control registers
• Internally self-timed Write Cycle
Addresses and chip enables are registered with either
Address Status Processor (ADSP) or address status controller
(ADSC) input pins. Subsequent burst addresses can be inter-
nally generated as controlled by the Burst Advance Pin (ADV).
• Burst control pins (interleaved or linear burst
Address, data inputs, and Write controls are registered on-chip
to initiate self-timed Write cycle. Write cycles can be one to
sequence)
• Automatic power down available using ZZ mode or CE
deselect
• High-density, high-speed packages
• JTAG boundary scan for BGA packaging version
four bytes wide as controlled by the Write control inputs.
Individual byte Write allows individual byte to be written. BWa
controls DQ1-DQ8 and DP1. BWb controls DQ9-DQ16 and
DP2. BWc controls DQ17-DQ24and DP3. BWd controls
DQ25-DQ32 and DP4. BWa, BWb BWc, and BWd can be
active only with BWe being LOW. GW being LOW causes all
bytes to be written. Write pass-through capability allows
written data available at the output for the immediately next
Read cycle. This device also incorporates pipelined enable
circuit for easy depth expansion without penalizing system
performance.
Functional Description
The Cypress Synchronous Burst SRAM family employs
high-speed, low power CMOS designs using advanced
single-layer polysilicon, triple-layer metal technology. Each
memory cell consists of six transistors.
The CY7C1381B and CY7C1383B SRAMs integrate
524,288 × 36 and 1,048,576 × 18 SRAM cells with advanced
synchronous peripheral circuitry and a 2-bit counter for
All inputs and outputs of the CY7C1381B and the CY7C1383B
are JEDEC-standard JESD8-5-compatible.
Selection Guide
117 MHz
100 MHz
8.5
83 MHz
10.0
185
Unit
ns
Maximum Access Time
7.5
250
20
Maximum Operating Current
Maximum CMOS Standby Current
225
mA
mA
20
20
Cypress Semiconductor Corporation
•
3901 North First Street
•
San Jose
•
CA 95134
•
408-943-2600
Document #: 38-05196 Rev. **
Revised December 3, 2001