CY7C1370B
CY7C1372B
512K × 36/1M × 18 Pipelined SRAM with NoBL Architecture
inputs include all addresses, all data inputs, depth-expansion
Chip Enables (CE1, CE2, and CE3), cycle start input (ADV/LD),
Features
• Zero Bus Latency, no dead cycles between Write and
Clock enable (CEN), byte Write Enables (BWSa, BWSb,
BWSc, and BWSd), and Read-Write Control (WE). BWSc and
BWSd apply to CY7C1370B only.
Read cycles
• Fast clock speed: 200, 167, 150, and 133 MHz
• Fast access time: 3.0, 3.4, 3.8, and 4.2 ns
• Internally synchronized registered outputs eliminate
the need to control OE
Address and control signals are applied to the SRAM during
one clock cycle, and two cycles later, its associated data
occurs, either Read or Write.
• Single 3.3V –5% and +10% power supply VDD
• Separate VDDQ for 3.3V or 2.5V I/O
• Single WE (Read/Write) control pin
• Positive clock-edge triggered address, data, and
control signal registers for fully pipelined applications
A
Clock enable (CEN) pin allows operation of the
CY7C1370B/CY7C1372B to be suspended as long as
necessary. All synchronous inputs are ignored when CEN is
HIGH and the internal device registers will hold their previous
values.
There are three chip enable pins (CE1, CE2, CE3) that allow
the user to deselect the device when desired. If any one of
these three are not active when ADV/LD is LOW, no new
memory operation can be initiated and any burst cycle in
progress is stopped. However, any pending data transfers
(Read or Write) will be completed. The data bus will be in
high-impedance state two cycles after the chip is deselected
or a Write cycle is initiated.
• Interleaved or linear four-word burst capability
• Individual byte Write (BWSa–BWSd) control (may be
tied LOW)
• CEN pin to enable clock and suspend operations
• Three chip enables for simple depth expansion
• JTAG boundary scan (BGA package only)
• Available in 119-ball bump BGA and 100-pin TQFP
packages
The CY7C1370B and CY7C1372B have an on-chip two-bit
burst counter. In the burst mode, the CY7C1370B and
CY7C1372B provide four cycles of data for a single address
presented to the SRAM. The order of the burst sequence is
defined by the MODE input pin. The MODE pin selects
between linear and interleaved burst sequence. The ADV/LD
signal is used to load a new external address (ADV/LD = LOW)
or increment the internal burst counter (ADV/LD = HIGH)
• Automatic power down available using ZZ mode or CE
deselect
Functional Description
The CY7C1370B and CY7C1372B SRAMs are designed to
eliminate dead cycles when transitions from Read to Write or
vice versa. These SRAMs are optimized for 100 percent bus
utilization and achieve Zero Bus Latency. They integrate
524,288 × 36 and 1,048,576 × 18 SRAM cells, respectively,
with advanced synchronous peripheral circuitry and a 2-bit
counter for internal burst operation. The Synchronous Burst
SRAM family employs high-speed, low-power CMOS designs
using advanced single-layer polysilicon, three-layer metal
technology. Each memory cell consists of six transistors.
Output enable (OE) and burst sequence select (MODE) are
the asynchronous signals. OE can be used to disable the
outputs at any given time. ZZ may be tied to LOW if it is not
used.
Four pins are used to implement JTAG test capabilities. The
JTAG circuitry is used to serially shift data to and from the
device. JTAG inputs use LVTTL/LVCMOS levels to shift data
during this testing mode of operation.
All synchronous inputs are gated by registers controlled by a
positive-edge-triggered Clock input (CLK). The synchronous
Logic Block Diagram
D
CLK
Data-In REG.
CE
Q
ADV/LD
Ax
CEN
CE
2
CE
3
CONTROL
and Write
LOGIC
256K × 36/
512K × 18
MEMORY
1
CE
DQ
X
ARRAY
DP
WE
BWS
X
CY7C1370 CY7C1372
X = 18:0 X = 19:0
X
A
X
Mode
X = a, b, c, d X = a, b
DQ
X
X = a, b, c, d X = a, b
X = a, b, c, d X = a, b
DP
X
BWS
X
OE
Cypress Semiconductor Corporation
•
3901 North First Street
•
San Jose
•
CA 95134
•
408-943-2600
Document #: 38-05197 Rev. **
Revised December 3, 2001
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