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CY7C1157KV18 PDF预览

CY7C1157KV18

更新时间: 2024-11-23 09:43:39
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 静态存储器双倍数据速率
页数 文件大小 规格书
29页 863K
描述
18-Mbit DDR II+ SRAM Two-Word Burst Architecture (2.5 Cycle Read Latency)

CY7C1157KV18 数据手册

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CY7C1146KV18, CY7C1157KV18  
CY7C1148KV18, CY7C1150KV18  
18-Mbit DDR II+ SRAM Two-Word Burst  
Architecture (2.0 Cycle Read Latency)  
Features  
Configurations  
18 Mbit density (2 M x 8, 2 M x 9, 1 M x 18, 512 K x 36)  
450-MHz clock for high bandwidth  
With Read Cycle Latency of 2.0 cycles:  
CY7C1146KV18 – 2 M x 8  
CY7C1157KV18 – 2 M x 9  
Two-word burst for reducing address bus frequency  
CY7C1148KV18 – 1 M x 18  
CY7C1150KV18 – 512 K x 36  
Double data rate (DDR) interfaces  
(data transferred at 900 MHz) at 450 MHz  
Available in 2.0 clock cycle latency  
Functional Description  
Two input clocks (K and K) for precise DDR timing  
SRAM uses rising edges only  
The CY7C1146KV18, CY7C1157KV18, CY7C1148KV18, and  
CY7C1150KV18 are 1.8 V Synchronous Pipelined SRAMs  
equipped with DDR II+ architecture. The DDR II+ consists of an  
SRAM core with advanced synchronous peripheral circuitry.  
Addresses for read and write are latched on alternate rising  
edges of the input (K) clock. Write data is registered on the rising  
edges of both K and K. Read data is driven on the rising edges  
of K and K. Each address location is associated with two 8-bit  
words (CY7C1146KV18), 9-bit words (CY7C1157KV18), 18-bit  
words (CY7C1148KV18), or 36-bit words (CY7C1150KV18) that  
burst sequentially into or out of the device.  
Echo clocks (CQ and CQ) simplify data capture in high-speed  
systems  
Data valid pin (QVLD) to indicate valid data on the output  
Synchronous internally self-timed writes  
DDR II+ operates with 2.0 cycle read latency when DOFF is  
asserted HIGH  
Operates similar to DDR I device with one cycle read latency  
Asynchronous inputs include an output impedance matching  
input (ZQ). Synchronous data outputs (Q, sharing the same  
physical pins as the data inputs D) are tightly matched to the two  
output echo clocks CQ/CQ, eliminating the need for separately  
capturing data from each individual DDR SRAM in the system  
design.  
when DOFF is asserted LOW  
[1]  
Core VDD = 1.8V ± 0.1 V; I/O VDDQ = 1.4 V to VDD  
Supports both 1.5 V and 1.8 V I/O supply  
HSTL inputs and variable drive HSTL output buffers  
Available in 165-ball FBGA package (13 x 15 x 1.4 mm)  
Offered in both Pb-free and non Pb-free packages  
JTAG 1149.1 compatible test access port  
All synchronous inputs pass through input registers controlled by  
the K or K input clocks. All data outputs pass through output  
registers controlled by the K or K input clocks. Writes are  
conducted with on-chip synchronous self-timed write circuitry.  
Phase-locked loop (PLL) for accurate data placement  
Table 1. Selection Guide  
Description  
Maximum operating frequency  
450 MHz  
400 MHz  
400  
375 MHz  
375  
333 MHz  
333  
Unit  
MHz  
mA  
450  
550  
550  
560  
700  
Maximum operating current  
x8  
x9  
500  
480  
440  
500  
480  
440  
x18  
x36  
510  
490  
450  
640  
610  
560  
Note  
1. The Cypress QDR II+ devices surpass the QDR consortium specification and can support V  
= 1.4 V to V  
.
DD  
DDQ  
Cypress Semiconductor Corporation  
Document Number: 001-58912 Rev. *C  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised February 24, 2011  
[+] Feedback  

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