是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | BGA | 包装说明: | 35 X 35 MM, 1.27 MM PITCH, BGA-388 |
针数: | 388 | Reach Compliance Code: | compliant |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.92 |
其他特性: | ALSO OPERATES WITH 3.3V SUPPLY VOLTAGE | 系统内可编程: | YES |
JESD-30 代码: | S-PBGA-B388 | JESD-609代码: | e0 |
JTAG BST: | YES | 长度: | 35 mm |
湿度敏感等级: | 3 | 专用输入次数: | |
I/O 线路数量: | 294 | 宏单元数: | 2560 |
端子数量: | 388 | 最高工作温度: | 70 °C |
最低工作温度: | 组织: | 0 DEDICATED INPUTS, 294 I/O | |
输出函数: | MACROCELL | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | BGA | 封装等效代码: | BGA388,26X26,50 |
封装形状: | SQUARE | 封装形式: | GRID ARRAY |
峰值回流温度(摄氏度): | NOT SPECIFIED | 电源: | 1.5/3.3,2.5/3.3 V |
可编程逻辑类型: | LOADABLE PLD | 传播延迟: | 10 ns |
认证状态: | Not Qualified | 座面最大高度: | 2.46 mm |
子类别: | Programmable Logic Devices | 最大供电电压: | 2.7 V |
最小供电电压: | 2.3 V | 标称供电电压: | 2.5 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | COMMERCIAL | 端子面层: | TIN LEAD |
端子形式: | BALL | 端子节距: | 1.27 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 35 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
CY39165V388-125MGI | CYPRESS |
获取价格 |
Loadable PLD, 10ns, 2560-Cell, CMOS, PBGA388, BGA-388 | |
CY39165V388-181MBC | CYPRESS |
获取价格 |
CPLDs at FPGA Densities | |
CY39165V388-181MGC | CYPRESS |
获取价格 |
CPLDs at FPGA Densities | |
CY39165V388-181NC | CYPRESS |
获取价格 |
CPLDs at FPGA Densities | |
CY39165V388-233MGC | CYPRESS |
获取价格 |
CPLDs at FPGA Densities | |
CY39165V388-233MGI | CYPRESS |
获取价格 |
CPLDs at FPGA Densities | |
CY39165V388-233NTC | CYPRESS |
获取价格 |
CPLDs at FPGA Densities | |
CY39165V484-125BBC | CYPRESS |
获取价格 |
CPLDs at FPGA Densities | |
CY39165V484-125BBI | CYPRESS |
获取价格 |
CPLDs at FPGA Densities | |
CY39165V484-125BGC | CYPRESS |
获取价格 |
CPLDs at FPGA Densities |