是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | BGA | 包装说明: | 27 X 27 MM, 1.6 MM HEIGHT, 1 MM PITCH, FBGA-676 |
针数: | 676 | Reach Compliance Code: | compliant |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.92 |
其他特性: | ALSO OPERATES WITH 3.3V SUPPLY VOLTAGE | 系统内可编程: | YES |
JESD-30 代码: | S-PBGA-B676 | JESD-609代码: | e0 |
JTAG BST: | YES | 长度: | 27 mm |
专用输入次数: | I/O 线路数量: | 386 | |
宏单元数: | 2560 | 端子数量: | 676 |
最高工作温度: | 70 °C | 最低工作温度: | |
组织: | 0 DEDICATED INPUTS, 386 I/O | 输出函数: | MACROCELL |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | LBGA |
封装等效代码: | BGA676,26X26,40 | 封装形状: | SQUARE |
封装形式: | GRID ARRAY, LOW PROFILE | 峰值回流温度(摄氏度): | NOT SPECIFIED |
电源: | 1.5/3.3,2.5/3.3 V | 可编程逻辑类型: | LOADABLE PLD |
传播延迟: | 8.5 ns | 认证状态: | Not Qualified |
座面最大高度: | 1.6 mm | 子类别: | Programmable Logic Devices |
最大供电电压: | 2.7 V | 最小供电电压: | 2.3 V |
标称供电电压: | 2.5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | COMMERCIAL |
端子面层: | Tin/Lead (Sn/Pb) | 端子形式: | BALL |
端子节距: | 1 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 27 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
CY39165V676-83MBC | CYPRESS |
获取价格 |
Loadable PLD, 15ns, 2560-Cell, CMOS, PBGA676, 27 X 27 MM, 1.6 MM HEIGHT, 1 MM PITCH, FBGA- | |
CY39165Z208-125BBC | CYPRESS |
获取价格 |
CPLDs at FPGA Densities | |
CY39165Z208-125BBI | CYPRESS |
获取价格 |
CPLDs at FPGA Densities | |
CY39165Z208-125BGC | CYPRESS |
获取价格 |
CPLDs at FPGA Densities | |
CY39165Z208-125BGI | CYPRESS |
获取价格 |
CPLDs at FPGA Densities | |
CY39165Z208-125MBC | CYPRESS |
获取价格 |
CPLDs at FPGA Densities | |
CY39165Z208-125MBI | CYPRESS |
获取价格 |
CPLDs at FPGA Densities | |
CY39165Z208-125MGC | CYPRESS |
获取价格 |
CPLDs at FPGA Densities | |
CY39165Z208-125MGI | CYPRESS |
获取价格 |
CPLDs at FPGA Densities | |
CY39165Z208-125NC | CYPRESS |
获取价格 |
CPLDs at FPGA Densities |