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CXG7003FN PDF预览

CXG7003FN

更新时间: 2024-10-28 06:51:27
品牌 Logo 应用领域
索尼 - SONY 开关无绳电话集成电路电信集成电路电信电路放大器功率放大器光电二极管ISM频段无绳技术
页数 文件大小 规格书
9页 119K
描述
Power Amplifier/Antenna Switch + Low Noise Down Conversion Mixer for PHS

CXG7003FN 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:SOF
包装说明:HVSON,针数:26
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.82Is Samacsys:N
JESD-30 代码:R-PDSO-N26JESD-609代码:e6/e4
长度:5.6 mm功能数量:1
端子数量:26最高工作温度:85 °C
最低工作温度:-35 °C封装主体材料:PLASTIC/EPOXY
封装代码:HVSON封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE峰值回流温度(摄氏度):260
认证状态:Not Qualified座面最大高度:1 mm
标称供电电压:3 V表面贴装:YES
电信集成电路类型:CORDLESS TELEPHONE SUPPORT CIRCUIT温度等级:OTHER
端子面层:TIN BISMUTH/PALLADIUM端子形式:NO LEAD
端子节距:0.4 mm端子位置:DUAL
处于峰值回流温度下的最长时间:10宽度:4.4 mm
Base Number Matches:1

CXG7003FN 数据手册

 浏览型号CXG7003FN的Datasheet PDF文件第3页浏览型号CXG7003FN的Datasheet PDF文件第4页浏览型号CXG7003FN的Datasheet PDF文件第5页浏览型号CXG7003FN的Datasheet PDF文件第6页浏览型号CXG7003FN的Datasheet PDF文件第7页浏览型号CXG7003FN的Datasheet PDF文件第9页 
CXG7003FN  
Recommended Evaluation Board  
CXG7003FN  
Via Hole  
PAIN  
ANT2  
ANT1  
LOIN  
V
GG  
VDD_PA  
V
CTL1  
VCTL2  
VDD_LNA  
V
DD_LO  
IFOUT  
VDD_IF  
Via Hole  
Glass fabric-base epoxy board (4 layers)  
Thickness between layers 1 and 2: 0.2mm  
Dimensions: 50mm × 50mm  
VCTL2  
V
DD (LO)  
VCTL1  
VGG  
VDD (PA)  
V
DD (IF)  
V
DD (LNA)  
(Open)  
Enlarged Diagram of External Circuit Block  
L1 = 1.8nH  
L2 = 2.2nH  
L3 = 3.9nH  
C8  
C8  
L2  
C7  
C1  
C7  
C6  
L6  
L2  
L4 = 6.8nH  
L5 = 10nH  
L6 = 18nH  
L7 = 82nH  
C6  
L6  
L1  
C8  
C9  
C6  
C6  
C6  
C1 = 1pF  
C7  
L4  
C3  
C2 = 5pF  
L5  
C4  
C8  
C4  
C10  
L3  
C3 = 10pF  
C4 = 13pF  
C5 = 18pF  
C6 = 30pF  
C7 = 100pF  
C8 = 1nF  
C2  
C5  
C8  
L7  
C9 = 10nF  
C10 = 100nF  
C8  
– 8 –  

CXG7003FN 替代型号

型号 品牌 替代类型 描述 数据表
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