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CX-2C-SM11.0C PDF预览

CX-2C-SM11.0C

更新时间: 2024-11-06 06:51:23
品牌 Logo 应用领域
EUROQUARTZ 晶体
页数 文件大小 规格书
2页 101K
描述
CX MINIATURE CRYSTALS

CX-2C-SM11.0C 数据手册

 浏览型号CX-2C-SM11.0C的Datasheet PDF文件第2页 
CX MINIATURE CRYSTALS  
EUROQUARTZ  
Telephone:  
Fax:  
+44(0)1460 230000  
+44(0)1460 230001  
sales@euroquartz.co.uk  
www.euroquartz.co.uk  
Page  
CX-2-SM  
760kHz to 1.35MHz 1 of 2  
Email:  
Web:  
LLOOWW--PPRROOFFIILLEE  
SSMMDD CCRRYYSSTTAALL  
Extensional mode  
High shock resistance  
Designed for low-power applications  
Compatible with hybrid or PC board packaging  
Low ageing  
Full military environmental testing available  
Ideal for battery operated applications  
General Description  
The miniature CX-2-SM quartz crystal is a high quality leadless  
device suitable for mounting on printed circuit boards or hybrid  
substrates. The CX-2-SM is hermetically sealed in a rugged,  
leadless ceramic package. The crystal has been designed for  
surface-mounting on printed circuit boards or hybrid circuits. The  
crystal is manufactured using a photo-lithographic process,  
yielding consistently high quality production parts.  
Specification  
Frequency Range:  
Functional Mode:  
Calibration Tolerance*:  
760kHz to 1.35MHz  
Extensional  
1
A
B
C
±0.05% (±500ppm)  
±0.1%  
±1.0%  
2
A
I
H
G
3
F
Load Capacitance:  
7pF  
D
Motional Resistance (R ):  
Motional Capacitance (C ):  
Quality Factor (Q):  
5k max.  
1.2fF  
150k  
B
C
E
Terminal 1 is electrically connected to terminal 3  
Outline  
Shunt Capacitance (C ):  
Drive Level:  
Turning Point (T )**:  
1.0pF  
3 W max.  
35°C  
CX-2-SM Package Dimensions  
Note: Frequency (f) deviation from frequency (f ) @ turning point  
temperature (T ):  
Typical  
(mm)  
Maximum  
(mm)  
f-fo  
Dimension  
k(T-To)  
=
fo  
-0.035ppm/°C  
±5ppm max.  
Temperature Coefficient:  
Ageing, first year:  
Shock, survival:  
Vibration, survival:  
Operating Temperature:  
A
B
C
D
E
6.60  
2.39  
-
6.99  
2.74  
1000g 0.3ms, ½ sine  
10g rms, 20-1,000Hz random  
-10°~+70°C (commercial)  
-40°~+85°C (industrial)  
-55°~+125°C (military)  
-55°C~+125°C  
see below  
1.14  
0.89  
1.50  
1.27  
2.67  
3.94  
5.33  
1.75  
Storage Temperature:  
Process Temperature:  
F
1.52  
260°C for 20 seconds  
G
H
I
2.92  
Specifications are typical at 25°C unless otherwise indicated.  
4.19  
*
**  
Tighter frequency calibration available  
Other turning point available  
5.59  
Dimension  
“C”  
Glass Lid  
(mm max.)  
Ceramic Lid  
(mm max.)  
SM1  
SM2  
SM3  
1.65  
1.70  
1.78  
1.91  
1.96  
2.03  
Equivalent Circuit  
L
R
Solder Pad Layout  
C
C
1
2
2.67  
1
2
2.87  
R
C
Motional Resistance  
Motional Capacitance  
L
Motional Inductance  
Shunt Capacitance  
0.6  
C

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