CSPST08-220F

更新时间： 2024-01-08 02:25:32

品牌	Logo	应用领域
CALMIRCO		/
页数	文件大小	规格书
4页	55K
描述
CHIP SCALE SERIES TERMINATION ARRAY

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数据手册

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CSPST08-220F 数据手册

CALIFORNIA MICRO DEVICES

CSPST

Chip Scale SeriesTermination Array

Features

Applications

• 8 or 16 integrated high frequency series

terminations

• Series resistive bus termination

• Isolated resistor array

• Ultra small footprint Chip Scale Package

• Ceramic substrate

• 0.35mm Eutectic Solder Bumps, 0.65mm pitch

Product Description

The CSPST is a high performance Integrated Passive

Device (IPD) which provides series terminations suitable

for use in high speed bus applications. Eight (8) or

sixteen (16) series termination versions are provided.

These resistors provide excellent high frequency

performance in excess of 3GHz and are manufactured to

an absolute tolerance as low as 1ꢀ. The Chip Scale

Package provides an ultra small footprint for this IPD

and provides minimal parasitics compared to conven-

tional packaging. Typical bump inductance is less than

25pH. The large solder bumps and ceramic substrate

allow for standard attachment to laminate printed circuit

boards without the use of underfill.

SCHEMATIC DIAGRAMS

CSPST16

CSPST08

STANDARD VALUES

Resistor Value

R1 = 22Ω, 33Ω, 39Ω, 47Ω, 51Ω, 56Ω,

Absolute Tolerance R

TCR of Resistors

1%, 5%

100ppm

Power Rating/Resistor

Operating Temperature Range

100mW

–40°C to 85°C

C1300700

11/10/2000 215 Topaz Street, Milpitas, California 95035

Tel: (408) 263-3214

Fax: (408) 263-7846

www.calmicro.com

12 3 4

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