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CS5N50A4R

更新时间: 2024-03-03 10:11:37
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CS5N50A4R 数据手册

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CS5N50 A4R  
R
The name and content of poisonous and harmful material in products  
Hazardous Substance  
Pb  
Hg  
Cd  
Cr(VI)  
PBB  
PBDE  
DIBP  
DEHP  
DBP  
BBP  
Limit  
0.1% 0.1%  
0.1% 0.1% 0.1% 0.1% 0.1% 0.1% 0.1%  
0.01%  
Lead Frame  
Molding  
Chip  
×
Wire Bonding  
Solder  
○:Means the hazardous material is under the criterion of 2011/65/EU.  
×:Means the hazardous material exceeds the criterion of 2011/65/EU.  
Note  
The plumbum element of solder exist in products presently, but within the allowed range  
of Eurogroups RoHS.  
Warnings  
1. Exceeding the maximum ratings of the device in performance may cause damage to the device,  
even the permanent failure, which may affect the dependability of the machine. It is suggested  
to be used under 80 percent of the maximum ratings of the device.  
2. When installing the heat sink, please pay attention to the torsional moment and the smoothness  
of the heat sink.  
3. VDMOSFETs is the device which is sensitive to the static electricity, it is necessary to protect  
the device from being damaged by the static electricity when using it.  
4. This publication is made by Huajing Microelectronics and subject to regular change without  
notice.  
WUXI CHINA RESOURCES HUAJING MICROELECTRONICS CO., LTD.  
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WUXI CHINA RESOURCES HUAJING MICROELECTRONICS CO., LTD. Page 10 of 10  
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