CRS12
TOSHIBA Schottky Barrier Diode
CRS12
Switching Mode Power Supply Applications
(Output voltage: ≤12 V)
Unit: mm
DC/DC Converter Applications
•
•
•
•
Forward voltage: V
Average forward current: I
Repetitive peak reverse voltage: V
Suitable for compact assembly due to small surface-mount package
“S−FLATTM” (Toshiba package name)
= 0.58 V (max)
FM
= 1.0 A
F (AV)
= 60 V
RRM
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Repetitive peak reverse voltage
Average forward current
V
60
V
A
RRM
I
1.0 (Note 1)
20 (50 Hz)
−40~150
−40~150
F (AV)
Non-repetitive peak surge current
Junction temperature
I
A
FSM
T
j
°C
°C
Storage temperature range
T
stg
Note 1: Ta = 73°C
JEDEC
JEITA
―
―
Device mounted on a ceramic board
Board size: 50 mm × 50 mm
Soldering size: 2 mm × 2 mm
Board thickness: 0.64 t
TOSHIBA
3-2A1A
Rectangular waveform (α = 180°), V = 30 V
R
Weight: 0.013 g (typ.)
Note 2: Using continuously under heavy loads (e.g. the application of
high temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating
conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical Characteristics (Ta = 25°C)
Characteristics
Symbol
Test Condition
= 0.7 A (pulse test)
Min
Typ.
Max
Unit
V
V
V
I
I
⎯
⎯
⎯
⎯
⎯
0.48
0.52
0.4
⎯
0.58
⎯
FM (1)
FM (2)
FM
FM
Peak forward voltage
= 1.0 A (pulse test)
I
V
V
V
= 5 V (pulse test)
= 60 V (pulse test)
RRM (1)
RRM (2)
RRM
RRM
Peak repetitive reverse current
Junction capacitance
μA
I
4.0
100
⎯
C
= 10 V, f = 1.0 MHz
R
40
pF
j
Device mounted on a ceramic board
(board size: 50 mm × 50 mm)
(soldering land: 2 mm × 2 mm)
(board thickness: 0.64 t)
⎯
⎯
⎯
⎯
70
Device mounted on a glass-epoxy board
(board size: 50 mm × 50 mm)
(soldering land: 6 mm × 6 mm)
(board thickness: 1.6 t)
Thermal resistance
(junction to ambient)
R
th (j-a)
°C/W
140
Device mounted on a glass-epoxy board
(board size: 50 mm × 50 mm)
(soldering land: 1.2 mm × 1.2 mm)
(board thickness: 1.6 t)
⎯
⎯
⎯
⎯
240
20
Thermal resistance
(junction to lead)
R
th (j-ℓ)
⎯
°C/W
1
2006-11-13