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CRG09(TE85L,Q) PDF预览

CRG09(TE85L,Q)

更新时间: 2024-11-07 14:41:31
品牌 Logo 应用领域
东芝 - TOSHIBA 二极管
页数 文件大小 规格书
6页 181K
描述
RECTIFIER DIODE,SCHOTTKY,400V V(RRM),SOD-123VAR

CRG09(TE85L,Q) 技术参数

是否Rohs认证:符合生命周期:Obsolete
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8541.10.00.80风险等级:5.84
Is Samacsys:N配置:SINGLE
二极管类型:RECTIFIER DIODE最大正向电压 (VF):1.1 V
最大非重复峰值正向电流:15 A元件数量:1
最高工作温度:150 °C最大输出电流:1 A
最大重复峰值反向电压:400 V子类别:Rectifier Diodes
表面贴装:YES技术:SCHOTTKY
Base Number Matches:1

CRG09(TE85L,Q) 数据手册

 浏览型号CRG09(TE85L,Q)的Datasheet PDF文件第2页浏览型号CRG09(TE85L,Q)的Datasheet PDF文件第3页浏览型号CRG09(TE85L,Q)的Datasheet PDF文件第4页浏览型号CRG09(TE85L,Q)的Datasheet PDF文件第5页浏览型号CRG09(TE85L,Q)的Datasheet PDF文件第6页 
CRG09  
TOSHIBA Rectifier Silicon Diffused Type  
CRG09  
General Purpose Rectifier Applications  
Unit: mm  
Repetitive peak reverse voltage: V  
= 400 V  
RRM  
Average forward current: I  
= 1.0 A  
F (AV)  
Forward voltage: V  
= 1.1 V (max) (@I  
= 0.7 A)  
FM  
FM  
High ESD Capability  
Suitable for high-density board assembly due to the use of a small  
surface-mount package, SFLATTM  
0.9 ± 0.1  
0.16  
Absolute Maximum Ratings (Ta = 25°C)  
+ 0.2  
0.1  
1.6  
Characteristics  
Symbol  
Rating  
Unit  
Repetitive peak reverse voltage  
Average forward current  
Non-repetitive peak surge current  
Junction temperature  
V
400  
V
A
ANODE  
CATHODE  
RRM  
I
1.0 (Note 1)  
15 (50 Hz)  
40 to 150  
40 to 150  
F(AV)  
I
A
FSM  
T
j
°C  
°C  
JEDEC  
JEITA  
Storage temperature  
T
stg  
Note: Using continuously under heavy loads (e.g. the application of high  
temperature/current/voltage and the significant change in  
temperature, etc.) may cause this product to decrease in the  
reliability significantly even if the operating conditions (i.e.  
TOSHIBA  
3-2A1A  
Weight: 0.013 g (typ.)  
operating temperature/current/voltage, etc.) are within the absolute maximum ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
Note 1: Ta = 66°C  
Device mounted on a ceramic board  
Board size: 50 mm × 50 mm  
Soldering size: 2 mm × 2 mm  
Board thickness: 0.64 mm  
2010-08-05  
1

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