FACTSHEET F-200
CPC2–108–B–02–SG–CU
CPC2–116–E–03–SG
CPC2–110–B–01–SG
CPC2 SERIES
CHIP PACKAGE
S P ECIFICATIONS
Choice of cavity
up or down
Robust
Materials:
Phosphor Bronze
leads with soft
gold plating
Insulator Material:
ALS O AVAILABLE
Liquid Crystal Polymer
Contact Material:
Phosphor Bronze
Optional
Operating Temp Range:
lids for
chip/wire
bond
-65°C to +105°C with Tin;
-65°C to +125°C with Gold
Plating:
Au over 50µ"
(1,27µm) Ni
Current Rating:
Testing Now!
protection.
Max Processing Temp:
230°C for 60 seconds
SMT Lead Coplanarity:
(0,10mm) .004" max
Choice of
(0,64mm) .025"
or
(1,27mm) .050"
pitch
LEAD
PITCH
NO. OF
POSITIONS
BODY
STYLE
PLATING
OPTION
OTHER
OPTION
1
CPC2
Specify
BODY
STYLE
from
Leave blank
for Cavity
Down
–SG
–B
= 30µ"
(0,76µm)
= (0,64mm)
.025" Pitch
04, 08, 10, 16,
20, 24, 28
Soft Gold
(.9999 pure)
–CU
chart
–E
= Cavity
Up
= (1,27mm)
.050" Pitch
No. of positions x pitch / 2
+ (3,81) .150
No. of positions x
pitch / 2 + (1,50) .059
–LDC
= (1,52mm)
.060" thick
cupped
BODY
STYLE
A
B
C
No. of positions
x pitch / 2
+ (0,08) .003
(3,81) (7,54) (9,68)
.150 .297 .381
(7,62) (11,35) (13,49)
.300 .447 .531
(12,70) (16,43) (18,57)
.500 .647 .731
–01
lid with
(0,76mm)
.030" cavity
–02
–03
–LDF
= (0,76mm)
.030" thick
flat lid
B
A
C
(0,71)
.028
TYP
–CU Option
(Cavity up)
(0,20)
.008
(1,14)
.045
LEAD
D
D
PITCH
(1,65)
.065
(0,64)
.025
(1,27)
.050
–B
(2,79)
.110
(2,31)
.091
(0,81)
.032
–E
Standard Option
(Cavity down)
Note: Some sizes, styles and
options are non-standard,
non-returnable.
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Due to technical progress, all designs, specifications and components are subject to change without notice.