Datasheet > CP705-CZT4033-CM

CP705-CZT4033-CM

更新时间： 2024-09-30 14:48:35

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CP705-CZT4033-CM 技术参数

PROCESS CP705

Small Signal Transistor

PNP - High Current Transistor Chip

PROCESS DETAILS

Process

EPITAXIAL PLANAR

Die Size

31 x 31 MILS

9.0 MILS

Die Thickness

Base Bonding Pad Area

Emitter Bonding Pad Area

Top Side Metalization

Back Side Metalization

5.9 x 11.8 MILS

6.5 x 13.8 MILS

Al - 30,000Å

Au - 18,000Å

GEOMETRY

GROSS DIE PER 4 INCH WAFER

11,300

PRINCIPAL DEVICE TYPES

2N4033

CMPT4033

CXT4033

CZT4033

BACKSIDE COLLECTOR

145 Adams Avenue

Hauppauge, NY 11788 USA

Tel: (631) 435-1110

Fax: (631) 435-1824

www.centralsemi.com

R3 (23-August 2006)

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型号	品牌	获取价格	描述	数据表
CP705-CZT4033-CT	CENTRAL	获取价格	Transistor
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CP705-CZT4033-WS	CENTRAL	获取价格	Transistor
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CP705V-BC327	CENTRAL	获取价格	45V,500mA,625mW Bare die,31.100 X 31.100 mils,Transistor-Small Signal (<=1A)
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