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CP188V-BCX70K PDF预览

CP188V-BCX70K

更新时间: 2024-10-29 17:00:43
品牌 Logo 应用领域
CENTRAL /
页数 文件大小 规格书
9页 613K
描述
45V,100mA,350mW Bare die,14.568 X 14.568 mils,Transistor-Small Signal (<=1A)

CP188V-BCX70K 数据手册

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BARE DIE PACKING OPTIONS  
BARE DIE IN TRAY (WAFFLE) PACK  
CT: Singulated die in tray (waffle) pack.  
(example: CP211-PART NUMBER-CT)  
CM: Singulated die in tray (waffle) pack 100% visually inspected as  
per MIL-STD-750, (method 2072 transistors, method 2073 diodes).  
(example: CP211-PART NUMBER-CM)  
UNSAWN WAFER  
WN: Full wafer, unsawn, 100% tested with reject die inked.  
(example: CP211-PART NUMBER-WN)  
SAWN WAFER ON PLASTIC RING  
WR: Full wafer, sawn and mounted on plastic ring,  
100% tested with reject die inked.  
(example: CP211-PART NUMBER-WR)  
Please note: Sawn Wafer on Metal Frame (WS)  
is possible as a special order. Please contact your  
Central Sales Representative at 631-435-1110.  
Visit the Central website for a complete listing of specifications:  
www.centralsemi.com/bdspecs  
R2 (3-April 2017)  
www.centralsemi.com  

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