Datasheet > CP188V-BCX70K

CP188V-BCX70K

更新时间： 2024-04-09 18:58:39

品牌	Logo	应用领域
CENTRAL		/
页数	文件大小	规格书
9页	613K
描述
45V,100mA,350mW Bare die,14.568 X 14.568 mils,Transistor-Small Signal (<=1A)

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CP188V-BCX70K 数据手册

BARE DIE PACKING OPTIONS

BARE DIE IN TRAY (WAFFLE) PACK

CT: Singulated die in tray (waffle) pack.

(example: CP211-PART NUMBER-CT)

CM: Singulated die in tray (waffle) pack 100% visually inspected as

per MIL-STD-750, (method 2072 transistors, method 2073 diodes).

(example: CP211-PART NUMBER-CM)

UNSAWN WAFER

WN: Full wafer, unsawn, 100% tested with reject die inked.

(example: CP211-PART NUMBER-WN)

SAWN WAFER ON PLASTIC RING

WR: Full wafer, sawn and mounted on plastic ring,

100% tested with reject die inked.

(example: CP211-PART NUMBER-WR)

Please note: Sawn Wafer on Metal Frame (WS)

is possible as a special order. Please contact your

Central Sales Representative at 631-435-1110.

Visit the Central website for a complete listing of specifications:

www.centralsemi.com/bdspecs

R2 (3-April 2017)

www.centralsemi.com

1 234 5 6 7...9

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型号	品牌	获取价格	描述	数据表
CP189-CJD41C	CENTRAL	获取价格	100V,6A,20W Bare die,79.800 X 79.800 mils,Transistor-Bipolar Power (>1A)
CP-18-D-2-S-T	SAMTEC	获取价格	Interconnection Device
CP-18-D-2-TS1-ST2	SAMTEC	获取价格	Interconnection Device
CP-18-D-2-TS1-ST4	SAMTEC	获取价格	Interconnection Device
CP-18-D-2-TS1-T	SAMTEC	获取价格	Interconnection Device
CP-18-D-2-TS1-TP	SAMTEC	获取价格	Interconnection Device
CP-18-D-2-TS2-ST3	SAMTEC	获取价格	Interconnection Device
CP-18-D-2-TS2-ST4	SAMTEC	获取价格	Interconnection Device
CP-18-D-2-TS2-ST8	SAMTEC	获取价格	Interconnection Device
CP-18-D-2-T-ST2	SAMTEC	获取价格	Interconnection Device