Datasheet > CP10S120S

CP10S120S

更新时间： 2024-11-01 01:24:35

品牌	Logo	应用领域
竹懋 - CITC		/
页数	文件大小	规格书
3页	464K
描述
10A Surface Mount Trench Schottky Rectifier

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CP10S120S 数据手册

CP10S120S

10A Surface Mount Trench Schottky Rectifier

■ Features

■ Outline

• Low forward voltage drop.

TO-277

• Excellent high temperature stability.

• Fast switching capability.

0.264 (6.70)

0.248 (6.30)

PIN 1

PIN 3

PIN 2

• Suffix "G" indicates Halogen-free part, ex.CP10S120SG.

• Lead-free parts meet environmental standards of

MIL-STD-19500 /228

0.077 (1.96)

0.069 (1.76)

0.073 (1.85)

0.069 (1.75)

0.028 (0.71)

0.016 (0.41)

0.216 (5.48)

0.208 (5.28)

0.028 (0.71)

0.016 (0.41)

■ Mechanical data

0.037 (0.95)

0.033 (0.85)

• Epoxy : UL94-V0 rated flame retardant.

• Case : Molded plastic, TO-277.

• Lead : Solder plated, solderable per MIL-STD-750,

Method 2026.

• Polarity: Indicated by cathode band.

• Mounting Position : Any.

0.124 (3.15)

0.112 (2.85)

0.037 (0.95)

0.033 (0.85)

0.145 (3.69)

0.133 (3.39)

0.069 (1.74)

0.057 (1.44)

0.014 (0.35)

0.010 (0.25)

0.049 (1.25)

0.037 (0.95)

• Weight : Approximated 0.093 grams.

Dimensions in inches and (millimeters)

■ Maximum ratings and electrical characteristics

Rating at 25^OC ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load.

For capacitive load, derate current by 20%.

Parameter

Marking code

Conditions

Symbol

CP10S120S

UNIT

Peak repetitive reverse voltage

Working peak reverse voltage

DC blocking voltage

V_RRM

V_RWM

V_RM

I_O

120

Forward rectified current

8.3ms single half sine-wave superimposed on

rate load (JEDEC method)

Forward surge current

I_FSM

200

^OC/W

^OC

R_θJA

Thermal resistance(1)

Junction to ambient

Operating and Storage temperature

T_J, T_STG

-65 ~ +150

Parameter

Conditions

I_F= 10A, T_J= 25^OC

I_F= 10A, T_J= 125^OC

V_R= V_RRMT_J= 25^OC

V_R= V_RRMT_J= 125^OC

Symbol

V_F

MIN.

TYP.

MAX.

730

640

0.1

UNIT

Forward voltage drop

I_R

Reverse current

Note : 1.Device mounted on Polymide PCB with 16x recommended pad layout.

Document ID : DS-12KG0

Revised Date : 2014/11/27

Revision : C

12 3

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