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CNY17F-3M PDF预览

CNY17F-3M

更新时间: 2024-11-12 19:29:15
品牌 Logo 应用领域
亿光 - EVERLIGHT 输出元件光电
页数 文件大小 规格书
13页 774K
描述
Transistor Output Optocoupler, 1-Element, 5000V Isolation, DIP-6

CNY17F-3M 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:DIP-6
Reach Compliance Code:compliantHTS代码:8541.40.80.00
Factory Lead Time:11 weeks风险等级:5.27
其他特性:UL APPROVEDColl-Emtr Bkdn Voltage-Min:80 V
配置:SINGLE标称电流传输比:100%
最大暗电源:50 nA最大正向电流:0.06 A
最大绝缘电压:5000 V元件数量:1
最高工作温度:110 °C最低工作温度:-55 °C
光电设备类型:TRANSISTOR OUTPUT OPTOCOUPLERBase Number Matches:1

CNY17F-3M 数据手册

 浏览型号CNY17F-3M的Datasheet PDF文件第2页浏览型号CNY17F-3M的Datasheet PDF文件第3页浏览型号CNY17F-3M的Datasheet PDF文件第4页浏览型号CNY17F-3M的Datasheet PDF文件第5页浏览型号CNY17F-3M的Datasheet PDF文件第6页浏览型号CNY17F-3M的Datasheet PDF文件第7页 
CNY17-X Series  
CNY17F-X Series  
6 PIN DIP PHOTOTRANSISTOR  
PHOTOCOUPLER  
Features  
Current transfer ratios in selected narrow range groups  
CNY17-1, CNY17F-1: 40-80%  
CNY17-2, CNY17F-2: 63-125%  
CNY17-3, CNY17F-3: 100-200%  
CNY17-4, CNY17F-4:160-320%  
High isolation voltage between input and output  
(Viso = 5000 Vrms)  
Creepage distance > 7.6 mm  
Operating temperature up to +110°C  
The CNY17F-X series offers no external base connection  
for minimum noise susceptibility  
Compact dual-in-line package  
Pb free and RoHS compliant.  
UL approved (No. E214129)  
VDE approved (No. 132249)  
SEMKO approved  
NEMKO approved  
DEMKO approved  
FIMKO approved  
CSA approved  
Schematic  
CNY17-X  
Description  
The CNY17-X and CNY17F-X series of devices each  
consist of an infrared emitting diode optically coupled to a  
phototransistor.  
Ipackaged in a 6-pin DIP package and available in  
wide-lead spacing and SMD option.  
1. Anode  
2. Cathode  
3. No Connection  
4. Emitter  
Applications  
5. Collector  
6. Base  
Power supply regulators  
Digital logic inputs  
Microprocessor inputs  
CNY17F-X  
1. Anode  
2. Cathode  
3. No Connection  
4. Emitter  
5. Collector  
6. No Connection  
Everlight Electronics Co., Ltd.  
Document NoDPC-0000038 Rev.5  
1
http:\\www.everlight.com  
December 28, 2009  

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