Model CM20 & CM25 Series are
currently available but not
Features
High resistance to heat and humidity
recommended for new designs.
220K
Resistance to mechanical shock and
pressure
Accurate dimensions for automatic
surface mounting
Applications
Mobile phones
Cellular phones
CTV, VCR, HIC, FDD
Wide inductance range (1.0 nH to 1000 μH)
RoHS compliant*
CM45, CM32, CM25, CM20, CM16, CM10 SMT Chip Inductors
General Specifications
Temperature Rise......................................................................................................................................................................................................20 ˚C max.
Ambient Temperature .............................................................................................................................................................................................. 80 ˚C max.
Operating Temperature
CM10, CM16, CM20, CM25, CM32............................................................................................................................................................-40 °C to +100 °C
CM45...........................................................................................................................................................................................................-40 °C to +125 °C
Storage Temperature
CM10, CM16, CM20, CM25, CM32 ..........................................................................................................................................................-40 °C to +100 °C
CM45..........................................................................................................................................................................................................-40 °C to +125 °C
Resistance to Soldering Heat.......................................................................................................................................................................260 ˚C, 5 seconds
Materials
Core Material
CM10, CM16................................................................................................................................................................................................Alumina Ceramic
CM20............................................................................................................................................................................................Polymer 10 nH to 1000 nH
CM25..............................................................................................................................................................................................Polymer 10 nH to 180 nH
CM32..............................................................................................................................................................................................Polymer 47 nH to 180 nH
Ferrite Core
CM25..........................................................................................................................................................................................................220 nH to 100 μH
CM32........................................................................................................................................................................................................................220 nH +
CM45...................................................................................................................................................................................................................................All
Coil Type
CM10, CM16 ...................................................................................................................................................................................................Copper plating
CM20, CM25, CM32, CM45................................................................................................................................................................................Copper wire
Enclosure
CM10, CM16 ..................................................................................................................................................................................................................Resin
CM20, CM25, CM32, CM45.................................................................................................................................................................................Epoxy resin
Terminal
CM10, CM16, CM20, CM25, CM32, CM45 .......................................................................................................................................................................Sn
Product Dimensions
CM100505, CM160808
CM201212
CM10:
CM10:
0.2 ± 0.1
0.2 ± 0.1
1.27 ± 0.30
(.050 ± .012)
(.008 ± .004)
(.008 ± .004)
CM16:
CM16:
0.3 ± 0.15
(.012 ± .006)
0.3 ± 0.15
(.012 ± .006)
CM10:
CM16:
0.5 ± 0.1
0.80 ± 0.15
1.00 ± 0.10
(. 039 ± .004)
(.020 ± .004) (.032 ± .006)
CM10:
1.0 ± 0.1
CM10:
CM16:
1.27 ± 0.20
0.5 ± 0.1
0.80 ± 0.15
(.040 ± .004)
(.050 ± .008)
CM16:
(.020 ± .004) (.032 ± .006)
MM
(INCHES)
1.6 ± 0.15
DIMENSIONS ARE:
(.063 ± .006)
1.20
(.047)
2.0 + 0.30 - 0.20
(.079 + .012 - .008)
CM252016
CM322522
CM453232
Marking
3.2 0.2
Marking
Marking
2.5
(.079)
2.0
(.079)
(.125 .008)
1.2
(.047)
1.2
(.047)
1.9
(.075)
4.5 0.3
(.177 .012)
2.5
(.10)
3.2
(.126)
1.6
(.063)
2.2
(.086)
3.2 ± 0.2
(.125 ± .008)
0.4
(.016)
0.6
(.024)
1.7 ± 0.2
(.066 ± .008)
1.0
(.039)
1.0
(.039)
Recommended Land Pattern Dimensions
Model
a
b
c
CM10
CM16
CM20
CM25
CM32
CM45
0.5 to 0.6 (.019 to .023)
0.8 to 1.0 (.032 to .039)
1.0 to 1.2 (.039 to .047)
1.4 to 1.5 (.055 to .059)
1.6 to 2.0 (.063 to .079)
2.4 to 2.6 (.094 to .102)
1.5 to 1.7 (.059 to .067)
2.0 to 2.6 (.079 to .102)
3.0 to 3.8 (.118 to .150)
3.5 to 4.0 (.138 to .157)
4.0 to 4.6 (.157 to .181)
5.5 to 6.0 (.217 to .236)
0.5 to 0.6 (.019 to .023)
0.7 to 0.9 (.028 to .035)
0.9 to 1.3 (.028 to .051)
1.2 to 1.6 (.047 to .063)
1.9 to 2.4 (.075 to .094)
2.0 to 3.0 (.079 to .118)
c
a
b
*RoHS Directive 2002/95/EC Jan 27, 2003 including Annex.
Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.
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