Features
Applications
■ Mobile phones
■ Cellular phones
■ CTV, VCR, HIC, FDD
■ High resistance to heat and humidity
■ Resistance to mechanical shock and
pressure
■ Accurate dimensions for automatic
surface mounting
220
■ Inductance range: 0.12 to 150 µH
■ RoHS compliant*
CM322522 Series - Chip Inductor
Electrical Specifications @25 °C
General Specifications
Operating Temperature
Inductance
................................-40 °C to +125 °C
(Temperature rise included)
Standard Other
Q
Test
Frequency
(MHz)
SRF
Min.
DCR
Max.
(Ω)
IDC
Bourns
Part No.
Tol.
(%)
Tol.
(%)
Min.
Storage Temperature
µH
(MHz)
(mA)
450
450
450
450
450
450
450
450
450
450
450
400
390
370
350
320
290
260
250
220
200
180
170
150
140
130
120
110
80
................................-40 °C to +125 °C
Resistance to Soldering Heat
CM322522-R12ML 0.12
CM322522-R15ML 0.15
CM322522-R18ML 0.18
20
20
20
20
20
20
20
20
20
20
20
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
N/A
N/A
N/A
10
10
10
10
10
10
10
10
5
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
20
20
20
25.2
25.2
25.2
25.2
25.2
25.2
25.2
25.2
25.2
25.2
25.2
7.96
7.96
7.96
7.96
7.96
7.96
7.96
7.96
7.96
7.96
7.96
7.96
2.52
2.52
2.52
2.52
2.52
2.52
2.52
2.52
2.52
2.52
2.52
2.52
0.796
0.796
0.796
500
450
400
350
320
300
250
220
180
160
140
120
100
85
0.22
0.25
0.28
0.32
0.36
0.4
0.45
0.5
0.55
0.6
0.65
0.7
0.75
0.85
0.9
1
1.1
1.2
1.3
1.5
1.6
1.8
2
.............................. 245 °C, 5 seconds
Temperature Rise..........................20 °C
Rated Current....Inductance drops 10 %
CM322522-R22*L
CM322522-R27*L
CM322522-R33*L
CM322522-R39*L
CM322522-R47*L
CM322522-R56*L
CM322522-R68*L
CM322522-R82*L
CM322522-1R0*L
CM322522-1R2*L
CM322522-1R5*L
CM322522-1R8*L
CM322522-2R2*L
CM322522-2R7*L
CM322522-3R3*L
CM322522-3R9*L
CM322522-4R7*L
CM322522-5R6*L
CM322522-6R8*L
CM322522-8R2*L
CM322522-100*L
CM322522-120*L
CM322522-150*L
CM322522-180*L
CM322522-220*L
CM322522-270*L
CM322522-330*L
CM322522-390*L
CM322522-470*L
CM322522-560*L
CM322522-680*L
CM322522-820*L
CM322522-101*L
CM322522-121*L
CM322522-151*L
0.22
0.27
0.33
0.39
0.47
0.56
0.68
0.82
1
Materials
Core..............................................Ferrite
Wire ...........................Enamelled copper
Enclosure.............................Epoxy resin
Terminal Finish ...................................Sn
Packaging...... 2,000 pcs. per 7-inch reel
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
5
Product Dimensions
5
2.90 0.2
(.114 .00ꢀ8
5
80
5
75
5
70
5
60
5
55
5
50
5
45
5
40
5
35
2.20 0.2
(.0ꢀ7 .00ꢀ8
5
30
2.1
2.5
2.8
3.3
3.7
5
12
5
20
15
5
20
0.60 +0.3/-0.0
0.60 +0.3/-0.0
(.024 +.012/-.0008
(.024 +.012/-.0008
18
5
20
3.20 0.4
(.126 .0168
22
5
20
27
5
20
33
5
17
5.6
6.4
7
70
39
5
16
65
47
5
15
60
56
5
13
8
55
0.75 +0.2
(.030 +.00ꢀ8
0.75 +0.2
(.030 +.00ꢀ8
1.00 0.2
68
5
12
9
50
82
5
11
10
45
(.039 .00ꢀ8
2.50 0.2
(.09ꢀ .00ꢀ8
100
120
150
5
10
11
40
5
10
11
70
5
8
15
65
Recommended Layout
* Enter Standard or Other Tolerance Code:
M = 20 %, ꢀ = 10 %, ꢁ = 5 %
1.9 ~ 2.4
(.075 ~ .0948
Schematic
1.2 ~ 1.3
(.047 ~ .0518
1.2 ~ 1.3
(.047 ~ .0518
1.6 ~ 2.0
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
(.063 ~ .0798
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device
performance may vary over time.
MM
(INCHES)
DIMENSIONS:
Users should verify actual device performance in their specific applications.
5秒后页面跳转
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
AMD宣布全球裁员约1000人，调整战略聚焦增长
英伟达新AI芯片Rubin或提前半年亮相
微信公众号
抖音公众号
浙公网安备 33010502006866号 浙ICP备10014259号-119
营业执照ICP证
数据手册
如果您发现信息不准确，
