Datasheet > CM252016_MDS

CM252016_MDS

更新时间： 2024-10-14 12:55:47

品牌	Logo	应用领域
伯恩斯 - BOURNS		/
页数	文件大小	规格书
1页	71K
描述
CM252016 Series Wirewound Chip Inductor

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数据手册

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CM252016_MDS 数据手册

MATERIAL DATA SHEET

Material

CM252016 Series

330K

Product Line

Date

Wirewound Chip Inductor

19-July-2004

Construction

Element

Material

CAS

If applicable

Average

Mass (%)

Sum

(%)

No.

Material Group

Ferrite

Remark

Weight (g)

Core

0.005

Copper (II) Oxide

Zinc Oxide

1317-38-0

1314-13-2

1313-99-1

1308-06-1

1333-86-4

100

Nickel Oxide

Cobalttetraoxide

Ferric Oxide

0.2

61.8

Solder

Internal Connection

0.001

RoHS exempted: High-melting

point solder

Tin

7440-31-5

100

Lead

Silver

Phosphor Bronze

Tin

7439-92-1

7440-22-4

97.3

1.7

100

99.3

Pad

Terminal Electrode

Terminal Solder

0.005

0.001

100

Solder Plate

7440-31-5

Copper

7440-58-8

7440-50-8

0.7

Wire

Coated Wire

Epoxy

0.006

0.001

0.004

100

Polyurethane Resin

Epoxy

Adhesive

Coating

25068-38-6

Others

Resin

Epoxy Resin

Phenol Novolac

Antimony Trichloride

Brominated epoxy

Fused Silica

29690-82-2

9003-35-4

1309-64-4

40039-93-8

60676-86-0

17.5

100

2.5

67.5

Total Weight

0.023

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