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CM160808-R22JL PDF预览

CM160808-R22JL

更新时间: 2024-11-14 22:54:31
品牌 Logo 应用领域
伯恩斯 - BOURNS /
页数 文件大小 规格书
4页 397K
描述
FIXED IND 220NH 70MA 7.5 OHM SMD

CM160808-R22JL 数据手册

 浏览型号CM160808-R22JL的Datasheet PDF文件第2页浏览型号CM160808-R22JL的Datasheet PDF文件第3页浏览型号CM160808-R22JL的Datasheet PDF文件第4页 
Features  
nꢀ Highꢀresistanceꢀtoꢀheatꢀandꢀhumidity  
nꢀ Resistanceꢀtoꢀmechanicalꢀshockꢀandꢀꢀ  
pressure  
nꢀ Accurateꢀdimensionsꢀforꢀautomaticꢀꢀ  
surfaceꢀmounting  
220K  
nꢀ Wideꢀinductanceꢀrangeꢀ(1.0ꢀnHꢀtoꢀ1000ꢀµH)ꢀ  
nꢀ RoHSꢀcompliant*  
CM45 Series SMT Chip Inductors  
General Specifications  
Temperature Rise...................................................................................................................................................................... 20 ˚C max.  
Ambient Temperature .............................................................................................................................................................. 100 ˚C max.  
Operating Temperature....................................................................................................................................................-40 °C to +125 °C  
Storage Temperature.......................................................................................................................................................-40 °C to +125 °C  
Resistance to Soldering Heat.........................................................................................................................................260 ˚C, 5 seconds  
Materials  
Core Material............................................................................................................................................................................Ferrite Core  
Coil Type...................................................................................................................................................................................Copper wire  
Enclosure..................................................................................................................................................................................Epoxy resin  
Terminal...................................................................................................................................................................................................Sn  
Product Dimensions  
Recommended Land Pattern Dimensions  
Marking  
c
3.2ꢀ ꢀ0.2  
(.125ꢀ ꢀ.008)  
1.2  
(.047)  
a
b
4.5ꢀ ꢀ0.3  
(.177ꢀ ꢀ.012)  
3.2ꢀ±ꢀ0.2  
(.125ꢀ±ꢀ.008)  
a
b
c
2.0 to 2.4  
(.079 to .094)  
5.0 to 5.3  
(.197 to .209)  
1.4 to 1.7  
(.055 to .067)  
1.7ꢀ±ꢀ0.2  
(.066ꢀ±ꢀ.008)  
1.0  
(.039)  
1.0  
(.039)  
MM  
(INCHES)  
DIMENSIONS:  
Soldering Profile  
Temperature  
Rising Area  
Preheat Area  
Reflow Area  
Forced Cooling Area  
6 °C / sec. max.  
150~200 °C / 60~180 sec.  
250  
245  
Peak Temperature:  
250 °C max.  
20 ~ 40 sec.  
217  
200  
60 ~ 150 sec.  
Time at Peak  
150  
100  
50  
Temperature -5 °C:  
20~40 sec. max.  
Time Above 217 °C:  
60 ~ 150 sec. max.  
200 ~ 250 % Average  
Ramp-up Rate:  
3 °C / sec. max.  
50  
100  
150  
200  
250  
0
Time (Seconds)  
WARNING Cancer and Reproductive Harm - www.P65Warnings.ca.gov  
*RoHSꢀDirectiveꢀ2002/95/ECꢀJan.ꢀ27,ꢀ2003ꢀincludingꢀannexꢀandꢀRoHSꢀRecastꢀ2011/65/EUꢀJuneꢀ8,ꢀ2011.ꢀ  
Specificationsꢀareꢀsubjectꢀtoꢀchangeꢀwithoutꢀnotice.  
Usersꢀshouldꢀverifyꢀactualꢀdeviceꢀperformanceꢀinꢀtheirꢀspecificꢀapplications.ꢀ  
Theꢀproductsꢀdescribedꢀhereinꢀandꢀthisꢀdocumentꢀareꢀsubjectꢀtoꢀspecificꢀlegalꢀdisclaimersꢀasꢀsetꢀforthꢀonꢀtheꢀlastꢀpageꢀofꢀthisꢀdocument,ꢀandꢀatꢀwww.bourns.com/docs/legal/disclaimer.pdf.  

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