Datasheet > CLB3G5C150K1000TC1

CLB3G5C150K1000TC1

更新时间： 2024-11-25 01:06:43

品牌	Logo	应用领域
村田 - MURATA		/
页数	文件大小	规格书
2页	163K
描述
Microwave Integrated Circuits

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CLB3G5C110K1000TC1

Appearance & Shape

Features

1. Fine grained high-density ceramic dielectric, pure

gold electrode and simple single layer structure

provide very reliable performance and excellent

frequency characteristics.

2. A wide selection of sizes from very miniature

0.25mm square is suited to high-density mounting.

3. For compatibility with the gold electrodes, die

bonding with Au-Sn is possible and wire bonding

with gold wire is possible.

4. To improve handling of bonding, Au-Sn coating is

available on one side or both sides.

5. Custom made type (dimensions, cap. values, etc.)

are also available upon request.

Applications

Packaging Information

1. Microwave Integrated Circuits

2. Microwave Devices

3. Optical Devices

Minimum

Order Quantity

Packaging

Specifications

Tray

4. Measuring Equipments

100

1 of 2

Attention

1.This datasheet is downloaded from the website of Murata Manufacturing Co., Ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued

without advance notice. Please check with our sales representatives or product engineers before ordering.

2.This datasheet has only typical specifications because there is no space for detailed specifications.

Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.

URL : http://www.murata.com/

：

Last updated 2016/06/10

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