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CLB3G5C150K1000TC1 PDF预览

CLB3G5C150K1000TC1

更新时间: 2024-11-06 01:06:43
品牌 Logo 应用领域
村田 - MURATA /
页数 文件大小 规格书
2页 163K
描述
Microwave Integrated Circuits

CLB3G5C150K1000TC1 数据手册

 浏览型号CLB3G5C150K1000TC1的Datasheet PDF文件第2页 
Product Search Data Sheet  
CLB3G5C110K1000TC1  
Appearance & Shape  
Features  
1. Fine grained high-density ceramic dielectric, pure  
gold electrode and simple single layer structure  
provide very reliable performance and excellent  
frequency characteristics.  
2. A wide selection of sizes from very miniature  
0.25mm square is suited to high-density mounting.  
3. For compatibility with the gold electrodes, die  
bonding with Au-Sn is possible and wire bonding  
with gold wire is possible.  
4. To improve handling of bonding, Au-Sn coating is  
available on one side or both sides.  
5. Custom made type (dimensions, cap. values, etc.)  
are also available upon request.  
Applications  
Packaging Information  
1. Microwave Integrated Circuits  
2. Microwave Devices  
3. Optical Devices  
Minimum  
Order Quantity  
Packaging  
TC  
Specifications  
Tray  
4. Measuring Equipments  
100  
1 of 2  
Attention  
1.This datasheet is downloaded from the website of Murata Manufacturing Co., Ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued  
without advance notice. Please check with our sales representatives or product engineers before ordering.  
2.This datasheet has only typical specifications because there is no space for detailed specifications.  
Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.  
URL : http://www.murata.com/  
Last updated 2016/06/10  

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