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CL31A106KACLNNC PDF预览

CL31A106KACLNNC

更新时间: 2024-11-09 12:56:11
品牌 Logo 应用领域
三星 - SAMSUNG /
页数 文件大小 规格书
2页 82K
描述
SPECIFICATION

CL31A106KACLNNC 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:1206
包装说明:, 1206Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8532.24.00.20
风险等级:5.48电容:10 µF
电容器类型:CERAMIC CAPACITOR介电材料:CERAMIC
高度:0.95 mmJESD-609代码:e3
长度:3.2 mm安装特点:SURFACE MOUNT
多层:Yes负容差:10%
端子数量:2最高工作温度:85 °C
最低工作温度:-55 °C封装形状:RECTANGULAR PACKAGE
封装形式:SMT包装方法:TR, CARDBOARD PAPER, 7 INCH
正容差:10%额定(直流)电压(URdc):25 V
尺寸代码:1206表面贴装:YES
温度特性代码:X5R温度系数:15% ppm/ °C
端子面层:Matte Tin (Sn) - with Nickel (Ni) barrier端子形状:WRAPAROUND
宽度:1.6 mmBase Number Matches:1

CL31A106KACLNNC 数据手册

 浏览型号CL31A106KACLNNC的Datasheet PDF文件第2页 
SPECIFICATION  
Samsung P/N : CL31A106KACLNNC  
CAP, 10, 25V, ±10%, X5R, 1206  
Supplier : Samsung electro-mechanics  
Product : Multi-layer Ceramic Capacitor  
Descriptiont :  
A. Samsung Part Number  
CL 31  
A
106  
K
A
C
L
N
N
C
Series  
Size  
SamsungꢀMultiꢁlayerꢀCeramicꢀCapacitor  
1.6  
1206 (inchꢀcode)  
L: 3.2 ±ꢀ0.2  
mm  
W:  
±ꢀ0.2 mm  
Thickness division  
Inner electrode  
Termination  
Plating  
Lowꢀprofile  
Ni  
Dielectric  
Capacitance  
Capacitance  
tolerance  
X5R  
Cu  
10  
Snꢀ100%  
Normal  
±10 %  
(PbꢀFree)  
Product  
Special  
Rated Voltage  
Thickness  
25 V  
Reservedꢀforꢀfutureꢀuse  
CardboardꢀType,ꢀ7"ꢀreel  
0.85 ±ꢀ0.1 mm  
Packaging  
B. Samsung Reliablility Test and Judgement condition  
Performance  
Test condition  
Capacitance  
Tan δ (DF)  
Withinꢀspecifiedꢀtolerance  
0.1 max.  
1.0±0.2Vrms  
1±10%  
Insulation  
RatedꢀVoltage  
60~120ꢀsec.  
10,000Mohmꢀorꢀ100Mohm㎌  
ꢀWhicheverꢀisꢀSmaller  
Noꢀabnormalꢀexteriorꢀappearance  
Noꢀdielectricꢀbreakdownꢀor  
mechanicalꢀbreakdown  
X5R  
Resistance  
Appearance  
Withstanding  
Voltage  
Microscopeꢀ(×10)  
250%  
ofꢀtheꢀratedꢀvoltage  
Temperature  
Characterisitcs  
Adhesive Strength  
of Termination  
Bending Strength  
(Fromꢀꢁ55ꢀtoꢀ85,ꢀCapacitanceꢀchangeꢀshoudꢀbeꢀwithinꢀ±15%)  
Noꢀpeelingꢀshallꢀbeꢀoccurꢀonꢀthe  
terminalꢀelectrode  
500gF,ꢀforꢀ10±1ꢀsec.  
Capacitanceꢀchangeꢀ: within ±12.5% Bendingꢀtoꢀtheꢀlimitꢀ(1mm)  
ꢀwithꢀ1.0mm/sec.  
Solderability  
Moreꢀthanꢀ75%ꢀofꢀterminalꢀsurface  
isꢀtoꢀbeꢀsolderedꢀnewly  
SnAg3.0Cu0.5ꢀsolder  
245±5,ꢀ3±0.3sec.  
(preheatingꢀ:ꢀ80~120ꢀforꢀ10~30sec.)  
Resistance to  
Soldering heat  
Capacitanceꢀchangeꢀ:ꢀ within ±7.5%  
Solderꢀpotꢀ:ꢀ270±5,ꢀ10±1sec.  
Tanꢀδ,ꢀIRꢀ:ꢀinitialꢀspec.  

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