型号 | 品牌 | 获取价格 | 描述 | 数据表 |
CIB21J260 | SAMSUNG |
获取价格 |
MULTILAYER CHIP COMPONENTS | |
CIB21J400 | SAMSUNG |
获取价格 |
MULTILAYER CHIP COMPONENTS | |
CIB21P110 | SAMSUNG |
获取价格 |
MULTILAYER CHIP COMPONENTS | |
CIB21P150 | SAMSUNG |
获取价格 |
MULTILAYER CHIP COMPONENTS | |
CIB21P260 | SAMSUNG |
获取价格 |
MULTILAYER CHIP COMPONENTS | |
CIB21P260NE | SAMSUNG |
获取价格 |
Chip Bead CIB/CIM Series For EMI Suppression | |
CIB21P330 | SAMSUNG |
获取价格 |
MULTILAYER CHIP COMPONENTS | |
CIB21P470 | SAMSUNG |
获取价格 |
MULTILAYER CHIP COMPONENTS | |
CIB32P600NE | SAMSUNG |
获取价格 |
Chip Bead CIB/CIM Series For EMI Suppression | |
CIC05J600 | SAMSUNG |
获取价格 |
Chip Bead CIC/CIS Series For High Current |