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CGA3E3X7R1H224K080AB_17 PDF预览

CGA3E3X7R1H224K080AB_17

更新时间: 2024-11-07 01:16:39
品牌 Logo 应用领域
东电化 - TDK /
页数 文件大小 规格书
3页 238K
描述
Multilayer Ceramic Chip Capacitors

CGA3E3X7R1H224K080AB_17 数据手册

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Creation Date : June 16, 2017 (GMT)  
Multilayer Ceramic Chip Capacitors  
CGA3E1X7R1C105K080AC  
TDK item description CGA3E1X7R1C105KT****  
Applications  
Feature  
Automotive Grade  
General General (Up to 50V)  
AEC-Q200 AEC-Q200  
Series  
Status  
CGA3(1608) [EIA 0603]  
Production  
Size  
1.60mm ±0.10mm  
Length(L)  
Width(W)  
0.80mm ±0.10mm  
0.80mm ±0.10mm  
0.20mm Min.  
Thickness(T)  
Terminal Width(B)  
Terminal Spacing(G)  
0.30mm Min.  
0.70mm to 1.00mm(Flow Soldering)  
0.60mm to 0.80mm(Reflow Soldering)  
Recommended Land Pattern (PA)  
Recommended Land Pattern (PB)  
Recommended Land Pattern (PC)  
0.80mm to 1.00mm(Flow Soldering)  
0.60mm to 0.80mm(Reflow Soldering)  
0.60mm to 0.80mm(Flow Soldering)  
0.60mm to 0.80mm(Reflow Soldering)  
Electrical Characteristics  
Capacitance  
1μF ±10%  
16VDC  
Rated Voltage  
Temperature Characteristic  
Dissipation Factor (Max.)  
Insulation Resistance (Min.)  
X7R(±15%)  
5%  
100MΩ  
Other  
Wave (Flow)  
Reflow  
Soldering Method  
AEC-Q200  
Yes  
Packing  
Punched (Paper)Taping [180mm Reel]  
4000pcs  
Package Quantity  
! Images are for reference only and show exemplary products.  
! This PDF document was created based on the data listed on the TDK Corporation website.  
! All specifications are subject to change without notice.  
Copyright(c) TDK Corporation. All rights reserved.  

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