是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | SOIC |
包装说明: | SOIC-16 | 针数: | 16 |
Reach Compliance Code: | compliant | ECCN代码: | 3A001.A.2.C |
HTS代码: | 8542.32.00.41 | Factory Lead Time: | 1 week |
风险等级: | 1.44 | Is Samacsys: | N |
系列: | HC/UH | JESD-30 代码: | R-PDSO-G16 |
JESD-609代码: | e4 | 长度: | 9.9 mm |
逻辑集成电路类型: | LOGIC CIRCUIT | 最大I(ol): | 0.0078 A |
湿度敏感等级: | 1 | 位数: | 4 |
功能数量: | 1 | 端子数量: | 16 |
最高工作温度: | 125 °C | 最低工作温度: | -55 °C |
输出特性: | 3-STATE | 输出极性: | TRUE |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | SOP |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE |
包装方法: | TUBE | 峰值回流温度(摄氏度): | 260 |
最大电源电流(ICC): | 0.08 mA | Prop。Delay @ Nom-Sup: | 42 ns |
传播延迟(tpd): | 42 ns | 认证状态: | Not Qualified |
施密特触发器: | No | 座面最大高度: | 1.75 mm |
最大供电电压 (Vsup): | 6 V | 最小供电电压 (Vsup): | 2 V |
标称供电电压 (Vsup): | 4.5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | MILITARY |
端子面层: | Nickel/Palladium/Gold (Ni/Pd/Au) | 端子形式: | GULL WING |
端子节距: | 1.27 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 3.91 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
CD74HC670MTE4 | TI |
完全替代 |
High-Speed CMOS Logic 4x4 Register File | |
CD74HC670MT | TI |
完全替代 |
High-Speed CMOS Logic 4x4 Register File |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
CD74HC670M96 | TAOS |
获取价格 |
High-Speed CMOS Logic 4x4 Register File | |
CD74HC670M96 | TI |
获取价格 |
High-Speed CMOS Logic 4x4 Register File | |
CD74HC670M96E4 | TI |
获取价格 |
High-Speed CMOS Logic 4x4 Register File | |
CD74HC670M96E4 | TAOS |
获取价格 |
High-Speed CMOS Logic 4x4 Register File | |
CD74HC670M96E4 | ROCHESTER |
获取价格 |
Logic Circuit | |
CD74HC670M96G4 | TI |
获取价格 |
High-Speed CMOS Logic 4x4 Register File | |
CD74HC670M96G4 | TAOS |
获取价格 |
High-Speed CMOS Logic 4x4 Register File | |
CD74HC670ME4 | TAOS |
获取价格 |
High-Speed CMOS Logic 4x4 Register File | |
CD74HC670ME4 | TI |
获取价格 |
High-Speed CMOS Logic 4x4 Register File | |
CD74HC670MG4 | TAOS |
获取价格 |
High-Speed CMOS Logic 4x4 Register File |