是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
Reach Compliance Code: | not_compliant | 风险等级: | 5.7 |
JESD-30 代码: | R-PDSO-G16 | JESD-609代码: | e0 |
端子数量: | 16 | 最高工作温度: | 125 °C |
最低工作温度: | -55 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | SOP | 封装等效代码: | SOP16,.25 |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE |
电源: | 2/6 V | 认证状态: | Not Qualified |
子类别: | Other Memory ICs | 表面贴装: | YES |
技术: | CMOS | 温度等级: | MILITARY |
端子面层: | Tin/Lead (Sn/Pb) | 端子形式: | GULL WING |
端子节距: | 1.27 mm | 端子位置: | DUAL |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
CD74HC670M96 | TAOS |
获取价格 |
High-Speed CMOS Logic 4x4 Register File | |
CD74HC670M96 | TI |
获取价格 |
High-Speed CMOS Logic 4x4 Register File | |
CD74HC670M96E4 | TI |
获取价格 |
High-Speed CMOS Logic 4x4 Register File | |
CD74HC670M96E4 | TAOS |
获取价格 |
High-Speed CMOS Logic 4x4 Register File | |
CD74HC670M96E4 | ROCHESTER |
获取价格 |
Logic Circuit | |
CD74HC670M96G4 | TI |
获取价格 |
High-Speed CMOS Logic 4x4 Register File | |
CD74HC670M96G4 | TAOS |
获取价格 |
High-Speed CMOS Logic 4x4 Register File | |
CD74HC670ME4 | TAOS |
获取价格 |
High-Speed CMOS Logic 4x4 Register File | |
CD74HC670ME4 | TI |
获取价格 |
High-Speed CMOS Logic 4x4 Register File | |
CD74HC670MG4 | TAOS |
获取价格 |
High-Speed CMOS Logic 4x4 Register File |