CD74HC365-Q1, CD74HC366-Q1, CD74HCT365-Q1
www.ti.com
SCHS382 –JANUARY 2010
HIGH-SPEED CMOS LOGIC HEX BUFFER/LINE DRIVER, THREE-STATE NON-INVERTING
AND INVERTING
Check for Samples: CD74HC365-Q1, CD74HC366-Q1, CD74HCT365-Q1
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FEATURES
•
HCT Types
•
•
•
•
Qualified for Automotive Applications
–
–
4.5V to 5.5V Operation
Buffered Inputs
Direct LSTTL Input Logic Compatibility,
VIL= 0.8V (Max), VIH = 2V (Min)
High Current Bus Driver Outputs
–
CMOS Input Compatibility, Il ≤ 1mA at VOL,
VOH
Typical Propagation Delay tPLH, tPHL = 8ns at
VCC = 5V, CL = 15pF, TA = 25°C
•
Fanout (Over Temperature Range)
D PACKAGE
(TOP VIEW)
–
Standard Outputs . . . . . . . . . . . . . . . 10
LSTTL Loads
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Bus Driver Outputs . . . . . . . . . . . . . 15
LSTTL Loads
•
•
•
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Wide Operating Temperature Range . . . –40°C
to 125°C
Balanced Propagation Delay and Transition
Times
Significant Power Reduction Compared to
LSTTL Logic ICs
HC Types
–
–
2V to 6V Operation
High Noise Immunity: NIL = 30%, NIH = 30%
of VCC at VCC = 5V
DESCRIPTION
The CD74HC365-Q1, CD74HC366-Q1, and CD74HCT365-Q1 silicon gate CMOS three state buffers are general
purpose high-speed non-inverting and inverting buffers. They have high drive current outputs which enable high
speed operation even when driving large bus capacitances. These circuits possess the low power dissipation of
CMOS circuitry, yet have speeds comparable to low power Schottky TTL circuits. Both circuits are capable of
driving up to 15 low power Schottky inputs.
The CD74HC365-Q1 and CD74HCT365-Q1 are non-inverting buffers, whereas the CD74HC366-Q1 is an
inverting buffer. These devices have two three-state control inputs (OE1 and OE2) which are NORed together to
control all six gates.
The ’HCT365-Q1 logic families are speed, function and pin compatible with the standard LS logic family.
ORDERING INFORMATION(1)
TA
PACKAGE(2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
HC366Q
CD74HC366QDRQ1
–40°C to 125°C
SOIC – D
Reel of 2500
CD74HC365QDRQ1
Product Preview
Product Preview
CD74HCT365QDRQ1
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
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Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2010, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.