是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
包装说明: | DFP, FL14,.3 | Reach Compliance Code: | unknown |
风险等级: | 5.92 | JESD-30 代码: | R-XDFP-F14 |
JESD-609代码: | e0 | 逻辑集成电路类型: | NAND GATE |
端子数量: | 14 | 最高工作温度: | 125 °C |
最低工作温度: | -55 °C | 封装主体材料: | CERAMIC |
封装代码: | DFP | 封装等效代码: | FL14,.3 |
封装形状: | RECTANGULAR | 封装形式: | FLATPACK |
电源: | 5/10 V | 认证状态: | Not Qualified |
施密特触发器: | NO | 筛选级别: | MIL-STD-883 Class C |
子类别: | Gates | 表面贴装: | YES |
技术: | CMOS | 温度等级: | MILITARY |
端子面层: | Tin/Lead (Sn/Pb) | 端子形式: | FLAT |
端子节距: | 1.27 mm | 端子位置: | DUAL |
Base Number Matches: | 1 |
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