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CD4021B-MIL PDF预览

CD4021B-MIL

更新时间: 2024-02-10 03:06:43
品牌 Logo 应用领域
德州仪器 - TI 移位寄存器
页数 文件大小 规格书
13页 546K
描述
CMOS 8 级静态移位寄存器

CD4021B-MIL 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:DIP, DIP16,.3Reach Compliance Code:unknown
风险等级:5.92JESD-30 代码:R-PDIP-T16
JESD-609代码:e0位数:8
功能数量:1端子数量:16
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:DIP
封装等效代码:DIP16,.3封装形状:RECTANGULAR
封装形式:IN-LINE电源:3/15 V
认证状态:Not Qualified子类别:Shift Registers
表面贴装:NO技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:THROUGH-HOLE端子节距:2.54 mm
端子位置:DUALBase Number Matches:1

CD4021B-MIL 数据手册

 浏览型号CD4021B-MIL的Datasheet PDF文件第4页浏览型号CD4021B-MIL的Datasheet PDF文件第5页浏览型号CD4021B-MIL的Datasheet PDF文件第6页浏览型号CD4021B-MIL的Datasheet PDF文件第8页浏览型号CD4021B-MIL的Datasheet PDF文件第9页浏览型号CD4021B-MIL的Datasheet PDF文件第10页 
PACKAGE OPTION ADDENDUM  
www.ti.com  
28-Feb-2005  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 2  

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