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CD4021B-MIL PDF预览

CD4021B-MIL

更新时间： 2024-01-01 00:28:29
品牌 Logo 应用领域
德州仪器 - TI 移位寄存器
页数 文件大小 规格书
13页 546K
描述
CMOS 8 级静态移位寄存器

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CD4021B-MIL 技术参数

是否Rohs认证： 不符合生命周期：Obsolete
包装说明：DIP, DIP16,.3Reach Compliance Code：unknown
风险等级：5.92JESD-30 代码：R-PDIP-T16
JESD-609代码：e0位数：8
功能数量：1端子数量：16
最高工作温度：85 °C最低工作温度：-40 °C
封装主体材料：PLASTIC/EPOXY封装代码：DIP
封装等效代码：DIP16,.3封装形状：RECTANGULAR
封装形式：IN-LINE电源：3/15 V
认证状态：Not Qualified子类别：Shift Registers
表面贴装：NO技术：CMOS
温度等级：INDUSTRIAL端子面层：Tin/Lead (Sn/Pb)
端子形式：THROUGH-HOLE端子节距：2.54 mm
端子位置：DUALBase Number Matches：1

CD4021B-MIL 数据手册

 浏览型号CD4021B-MIL的Datasheet PDF文件第3页浏览型号CD4021B-MIL的Datasheet PDF文件第4页浏览型号CD4021B-MIL的Datasheet PDF文件第5页浏览型号CD4021B-MIL的Datasheet PDF文件第7页浏览型号CD4021B-MIL的Datasheet PDF文件第8页浏览型号CD4021B-MIL的Datasheet PDF文件第9页 
PACKAGE OPTION ADDENDUM  
www.ti.com  
28-Feb-2005  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
CD4014BE  
ACTIVE  
PDIP  
N
16  
25  
Pb-Free  
(RoHS)  
CU NIPDAU Level-NC-NC-NC  
CD4014BF3A  
CD4014BM  
ACTIVE  
ACTIVE  
CDIP  
SOIC  
J
16  
16  
1
None  
Call TI Level-NC-NC-NC  
D
40  
Pb-Free  
(RoHS)  
CU NIPDAU Level-2-260C-1 YEAR/  
Level-1-235C-UNLIM  
CD4014BM96  
CD4014BMT  
CD4014BNSR  
CD4014BPW  
CD4014BPWR  
CD4021BE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
SO  
D
D
16  
16  
16  
16  
16  
16  
2500  
250  
2000  
90  
Pb-Free  
(RoHS)  
CU NIPDAU Level-2-260C-1 YEAR/  
Level-1-235C-UNLIM  
Pb-Free  
(RoHS)  
CU NIPDAU Level-2-260C-1 YEAR/  
Level-1-235C-UNLIM  
NS  
PW  
PW  
N
Pb-Free  
(RoHS)  
CU NIPDAU Level-2-260C-1 YEAR/  
Level-1-235C-UNLIM  
TSSOP  
TSSOP  
PDIP  
Pb-Free  
(RoHS)  
CU NIPDAU Level-1-250C-UNLIM  
CU NIPDAU Level-1-250C-UNLIM  
CU NIPDAU Level-NC-NC-NC  
2000  
25  
Pb-Free  
(RoHS)  
Pb-Free  
(RoHS)  
CD4021BF  
CD4021BF3A  
CD4021BM  
ACTIVE  
ACTIVE  
ACTIVE  
CDIP  
CDIP  
SOIC  
J
J
16  
16  
16  
1
1
None  
None  
Call TI  
Call TI  
Level-NC-NC-NC  
Level-NC-NC-NC  
D
40  
Pb-Free  
(RoHS)  
CU NIPDAU Level-2-260C-1 YEAR/  
Level-1-235C-UNLIM  
CD4021BM96  
CD4021BMT  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
SO  
D
D
16  
16  
16  
16  
16  
16  
2500  
250  
2000  
90  
Pb-Free  
(RoHS)  
CU NIPDAU Level-2-260C-1 YEAR/  
Level-1-235C-UNLIM  
Pb-Free  
(RoHS)  
CU NIPDAU Level-2-260C-1 YEAR/  
Level-1-235C-UNLIM  
CD4021BNSR  
CD4021BPW  
NS  
PW  
PW  
J
Pb-Free  
(RoHS)  
CU NIPDAU Level-2-260C-1 YEAR/  
Level-1-235C-UNLIM  
TSSOP  
TSSOP  
CDIP  
Pb-Free  
(RoHS)  
CU NIPDAU Level-1-250C-UNLIM  
CD4021BPWR  
JM38510/05754BEA  
2000  
1
Pb-Free  
(RoHS)  
CU NIPDAU Level-1-250C-UNLIM  
None  
Call TI  
Level-NC-NC-NC  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional  
product content details.  
None: Not yet available Lead (Pb-Free).  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,  
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder  
temperature.  
Addendum-Page 1  
1...3456789...13

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