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CD4001BM PDF预览

CD4001BM

更新时间: 2024-02-24 09:48:10
品牌 Logo 应用领域
德州仪器 - TI
页数 文件大小 规格书
12页 522K
描述
CMOS NOR Gates

CD4001BM 数据手册

 浏览型号CD4001BM的Datasheet PDF文件第3页浏览型号CD4001BM的Datasheet PDF文件第4页浏览型号CD4001BM的Datasheet PDF文件第5页浏览型号CD4001BM的Datasheet PDF文件第7页浏览型号CD4001BM的Datasheet PDF文件第8页浏览型号CD4001BM的Datasheet PDF文件第9页 
PACKAGE OPTION ADDENDUM  
www.ti.com  
28-Feb-2005  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
CD4025BPWR  
ACTIVE  
TSSOP  
PW  
14  
2000  
Pb-Free  
(RoHS)  
CU NIPDAU Level-1-250C-UNLIM  
JM38510/05252BCA  
JM38510/05254BCA  
ACTIVE  
ACTIVE  
CDIP  
CDIP  
J
J
14  
14  
1
1
None  
None  
Call TI  
Call TI  
Level-NC-NC-NC  
Level-NC-NC-NC  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional  
product content details.  
None: Not yet available Lead (Pb-Free).  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,  
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 2  

CD4001BM 替代型号

型号 品牌 替代类型 描述 数据表
CD4001BPW TI

完全替代

CMOS NOR Gates
CD4001BE TI

完全替代

CMOS NOR Gates

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