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CD214B-R3400 PDF预览

CD214B-R3400

更新时间: 2024-11-11 04:52:15
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伯恩斯 - BOURNS /
页数 文件大小 规格书
4页 356K
描述
CD214B-R350~R31000 Glass Passivated Rectifiers

CD214B-R3400 数据手册

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Features  
Lead free as standard  
RoHS compliant*  
Glass passivated chip  
Low reverse leakage current  
Low forward voltage drop  
High current capability  
CD214B-R350~R31000 Glass Passivated Rectifiers  
General Information  
The markets of portable communications, computing and video equipment are challenging the semiconductor industry to develop  
increasingly smaller electronic components. Bourns offers Glass Passivated Rectifiers for rectification applications, in compact chip  
DO-214AA (SMB) size format, which offer PCB real estate savings and are considerably smaller than most competitive parts. The Glass  
Passivated Rectifier Diodes offer a forward current of 3.0 A with a choice of repetitive peak reverse voltage of 50 V up to 1000 V.  
Bourns® Chip Diodes conform to JEDEC standards, are easy to handle on standard pick and place equipment and their flat configuration  
minimizes roll away.  
Electrical Characteristics (@ T = 25 °C Unless Otherwise Noted)  
A
CD214B-  
R3400  
Parameter  
Symbol  
Unit  
R350  
R3100  
R3200  
R3600  
R3800  
R31000  
Maximum Repetitive  
Peak Reverse Voltage  
V
V
50  
100  
200  
400  
280  
400  
600  
800  
1000  
V
V
V
RRM  
Maximum RMS Voltage  
35  
50  
70  
140  
200  
420  
600  
560  
800  
700  
RMS  
Maximum DC  
Blocking Voltage  
V
100  
1000  
DC  
Max. Average Forward  
Rectified Current1  
I
3.0  
5.0  
A
(AV)  
DC Reverse Current @  
Rated DC Blocking Voltage  
I
µA  
R
R
(@T = 25 °C)  
J
DC Reverse Current @  
Rated DC Blocking Voltage  
I
50  
µA  
(@T = 125 °C)  
J
Typical Junction Capacitance2  
C
40  
1.0  
13  
pF  
V
J
Maximum Instantaneous  
Forward Voltage @ 1 A  
Typical Thermal Resistance3  
V
F
R
θJL  
°C/W  
Peak forward surge current  
8.3 ms single half sine-wave  
superimposed on rated load  
(JEDEC Method)  
I
115  
A
FSM  
Notes:  
1 See Forward Derating Curve.  
2 Measured @ 1.0 MHz and applied reverse voltage of 4.0 VDC.  
3 Thermal resistance from junction to ambient and from junction to lead P.C.B. mounted on 0.2 ˝ x 0.2 ˝ (5.0 mm x 5.0 mm) copper pad areas.  
Thermal Characteristics (@ T = 25 °C Unless Otherwise Noted)  
A
Parameter  
Symbol  
TJ  
CD214B-R350~R31000  
-65 to +175  
Unit  
°C  
Operating Temperature Range  
Storage Temperature Range  
TSTG  
-65 to +175  
°C  
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  

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